CPUs

Apple A16 Bionic vs Apple A2 Full Specs

6 Cores(2P+4E)
6 Threads(2P+4E)
3.44GHz
1 Cores
1 Threads
533MHz
TDP
5W
TDP
5W
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
1.1GB/s
LPDDR
iGPU
iGPU
··
1.71 TFLOPSFP16
··
266 MFLOPSFP32

A16 BionicA16 Bionic2,560
x1
A2A2-
-

6 Cores
2P
4E
1 Cores
1P
-
6 Threads
2P
4E
1 Threads
1P
-

Base Clock
3.44GHz
Base Clock
533MHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
16KB P
-
L1d
128KB P
64KB E
L1d
16KB P
-
L2
16MB P shared
4MB E shared
L2
-
-
-
SLC Cache
24MB
SLC Cache
-

Type
LPDDR5
Type
LPDDR
Max Memory
8GB
Max Memory
128MB
ECC
No
ECC
No
Channels
1
Channels
1
Bus Width
64-bit
Bus Width
32-bit
Speed
6400MT/s
Speed
266MT/s
Bandwidth
51.2GB/s
Bandwidth
1.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
1.1GB/s

TDP
5W
TDP
5W

PCIe
PCIe 4.0 x4
7.9GB/sBandwidth
-

iGPU
iGPU
Shaders
640
Shaders
1
Boost Clock
1.34GHz
Boost Clock
133MHz
··
1.71 TFLOPSFP16
··
266 MFLOPSFP32

NPU Model
H15 Themis
NPU Model
-
NPU Cores
16
NPU Cores
-
NPU Clock
2.06GHz
NPU Clock
-
Performance
17 TOPSFP16
Performance
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch32
Architecture
Architecture
Family
Family
Branding
A16  branding
Branding
A2  branding
Codename
Crete
A16Variant
EverestP-Core
Sawtooth E-Core
Codename
A2
-
ARM11P-Core
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 16, 2022
Release Date
Sep 9, 2008

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N4P
Fabrication Node
65nm
Die Size
115mm²
Die Size
36mm²
Transistor Count
16 Billion
Transistor Count
-
Transistor Density
139 MTr/mm²
Transistor Density
-

No images available
No images available

Smartphones
Smartphones