CPUs

Intel Core Ultra 5 226V vs Qualcomm Snapdragon X Elite (X1E-78-100) Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
4.5GHz
12 Cores
12 Threads
3.4GHz
TDP
17W
TDP
80W
Bandwidth
136.5GB/s
LPDDR5X
Bandwidth
135.2GB/s
LPDDR5X
iGPU
iGPU
··
106.1 TOPSINT4 Tensor
··
7.68 TFLOPSFP16
Socket
Socket
-

8 Cores
4P
4E
12 Cores
12P
-
8 Threads
4P
4E
12 Threads
12P
-

Base Clock
4.5GHz
Base Clock
3.4GHz
Overclocking
Locked
Overclocking
Locked

L0i
64KB
L0i
-
L0d
48KB
L0d
-
L1i
-
64KB E
L1i
192KB P
-
L1d
192KB P
32KB E
L1d
96KB P
-
L2
2.5MB P
-
4MB E shared
L2
36MB P shared
-
L3
8MB
L3
-
SLC Cache
-
SLC Cache
6MB

Type
LPDDR5X
Type
LPDDR5X
Max Memory
16GB
Max Memory
64GB
ECC
No
ECC
No
Channels
2
Channels
8
Bus Width
128-bit
Bus Width
128-bit
Speed
8533MT/s
Speed
8448MT/s
Bandwidth
136.5GB/s
Bandwidth
135.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
136.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
135.2GB/s

TDP
17W
TDP
80W
cTDP-down
8W
cTDP-down
-
Peak Power
37W
Peak Power
-
Max Operating Temp
100°C Max
Max Operating Temp
-

PCIe
PCIe 5.0 x4
15.8GB/sBandwidth
PCIe
PCIe 4.0 x12
23.6GB/sBandwidth
PCIe Secondary
PCIe 4.0 x4
7.9GB/sBandwidth
PCIe Secondary
PCIe 3.0 x4
3.9GB/sBandwidth

iGPU
iGPU
Shaders
896
Shaders
1536
Boost Clock
1.85GHz
Boost Clock
1.25GHz
··
106.1 TOPSINT4 Tensor
··
7.68 TFLOPSFP16

NPU Model
AI Boost 4
NPU Model
Hexagon
NPU Cores
5
NPU Cores
-
Performance
40 TOPSINT8
Performance
45 TOPSINT8

Manufacturer
Manufacturer
ISA
x86-64
ISA
AArch64
Architecture
Architecture
OryonARMv8.7-A
Family
Family
Branding
Core Ultra 5 2023 branding
Branding
Snapdragon X Elite  branding
Codename
Lunar Lake-V
3Die
Lunar Lake-MXVariant
Lion CoveP-Core
SkymontE-Core
Codename
Hamoa
-
Snapdragon X EliteVariant
PhoenixP-Core
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 3, 2024
Release Date
Apr 24, 2024

Foundry
TSMC
Foundry
TSMC
Other Foundries
IntelFIB
TSMCIO
Other Foundries
-
Fabrication Node
N3B
22nmFIB
N6IO
Fabrication Node
N4P
-
-
Die Size
140mm²
46mm²IO
Die Size
170mm²
-