Intel Core Ultra 5 226V vs Qualcomm Snapdragon X Plus (X1P-64-100) Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.5GHz	10 Cores 10 Threads 3.4GHz
TDP 17W	TDP 23W
Bandwidth 136.5GB/s LPDDR5X	Bandwidth 135.2GB/s LPDDR5X
iGPU Arc 130V 1850MHz	iGPU Adreno X1 3.8T
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 7.68 TFLOPSFP16
Socket BGA 2833	Socket -

Core Config

8 Cores 4P 4E	10 Cores 10P -
8 Threads 4P 4E	10 Threads 10P -

Clocks

Base Clock 4.5GHz	Base Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L0i 64KB	L0i -
L0d 48KB	L0d -
L1i - 64KB E	L1i 192KB P -
L1d 192KB P 32KB E	L1d 96KB P -
L2 2.5MB P - 4MB E shared	L2 36MB P shared -
L3 8MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 16GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 8533MT/s	Speed 8448MT/s
Bandwidth 136.5GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 136.5GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s UC·Spec·OC 135.2GB/s

Power & Thermals

TDP 17W	TDP 23W
cTDP-down 8W	cTDP-down -
Peak Power 37W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 5.0 x4 15.8GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Arc 130V 1850MHz	iGPU Adreno X1 3.8T
Shaders 896	Shaders 1536
Boost Clock 1.85GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 7.68 TFLOPSFP16

NPU

NPU Model AI Boost 4	NPU Model Hexagon
NPU Cores 5	NPU Cores -
Performance 40 TOPSINT8	Performance 45 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Lunar Lake	Architecture OryonARMv8.7-A
Family Core Ultra Series 2	Family X Series
Branding	Branding
Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core	Codename Hamoa - Snapdragon X EliteVariant PhoenixP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Sep 3, 2024	Release Date Apr 24, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries IntelFIB TSMCIO	Other Foundries -
Fabrication Node N3B 22nmFIB N6IO	Fabrication Node N4P - -
Die Size 140mm² 46mm²IO	Die Size 170mm² -

Images

Used In

Laptops XPS 13(9350, Late 2024)Galaxy Book5 Pro 14(Early 2025)Galaxy Book5 Pro 16(Early 2025) Show 1 more	Laptops Surface Laptop 7 13(Mid 2024)Surface Laptop 7 15(Mid 2024)XPS 13(9345, Mid 2024) Show 2 more
Tablets -	Tablets Surface Pro 11(X Elite, Mid 2024)

Competitors

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QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X Plus (X1P-42-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X Plus (X1P-46-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X Plus (X1P-66-100) Show 12 more