Intel Core Ultra 9 275HX vs AMD Ryzen AI 9 HX 375 Full Specs

Summary

24 Cores(8P+16E) 24 Threads(8P+16E) 2.7GHz	12 Cores(4P+8E) 24 Threads(8P+16E) 2GHz
TDP 55W	TDP 28W
Bandwidth 102.4GB/s DDR5	Bandwidth 128GB/s LPDDR5X·DDR5
iGPU Graphics 4C 1900MHz	iGPU Radeon 890M 2900MHz
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 11.88 TFLOPSFP16
Socket BGA 2114	Socket FP8

Core Config

24 Cores 8P 16E	12 Cores 4P 8E
24 Threads 8P 16E	24 Threads 8P 16E

Clocks

Base Clock 2.7GHz	Base Clock 2GHz
Boost Clock 5.4GHz	Boost Clock 5.1GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 64KB P 64KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 48KB P -
L2 3MB P 16MB E shared	L2 1MB P -
L3 24MB	L3 24MB

Memory

Type DDR5	Type LPDDR5X·DDR5
Max Memory 192GB	Max Memory 256GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 8000MT/s
Bandwidth 102.4GB/s	Bandwidth 128GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 102.4GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s UC·Spec·OC 128GB/s

Power & Thermals

TDP 55W	TDP 28W
cTDP-down 45W	cTDP-down 15W
cTDP-up -	cTDP-up 54W
Peak Power 160W	Peak Power -
Max Operating Temp 105°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 8 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 16GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 5.0 x20 78.8GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Graphics 4C 1900MHz	iGPU Radeon 890M 2900MHz
Shaders 512	Shaders 1024
Boost Clock 1.9GHz	Boost Clock 2.9GHz
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 11.88 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model XDNA 2
NPU Cores 2	NPU Cores 32
Performance 13 TOPSINT8	Performance 55 TOPSINT8

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Arrow Lake	Architecture Zen 5
Family Core Ultra Series 2	Family Ryzen AI 300
Branding	Branding
Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core	Codename Strix Point - Zen 5P-Core Zen 5cE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jun 2, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node N3B N5iGPU N6IO N6SoC	Fabrication Node N4P - - -
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC	Die Size 233mm² - - -
Transistor Count -	Transistor Count 28 Billion
Transistor Density -	Transistor Density 120 MTr/mm²

Images

Used In

Laptops Blade 18(Early 2025)

Laptops -

Competitors

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AMDRyzen AI 9 HX 375 vs CPU AMDRyzen AI 9 365 AMDRyzen AI 9 HX 375 vs CPU AMDRyzen AI 9 HX 370 AMDRyzen AI 9 HX 375 vs CPU AMDRyzen AI 7 350 Show 12 more