Intel Core Ultra 9 285HX vs AMD Ryzen AI Max PRO 390 Full Specs
24 Cores(8P+16E) 24 Threads(8P+16E) 2.8GHz | 12 Cores 24 Threads 3.2GHz |
TDP 55W | TDP 65W |
Bandwidth 102.4GB/s DDR5 | Bandwidth 256GB/s LPDDR5X |
iGPU | iGPU |
·· 4.1 TFLOPSFP16 | ·· 22.94 TFLOPSFP16 |
Socket | Socket |
Core Ultra 9 285HX4.6GHz
Ryzen AI Max PRO 390-24 Cores 8P 16E | 12 Cores 12P - |
24 Threads 8P 16E | 24 Threads 24P - |
Base Clock 2.8GHz | Base Clock 3.2GHz |
Boost Clock 5.5GHz | Boost Clock 5GHz |
Overclocking Unlocked | Overclocking Locked |
L1i 64KB P 64KB E | L1i 32KB P - |
L1d 48KB P 32KB E | L1d 48KB P - |
L2 3MB P 16MB E shared | L2 1MB P - |
L3 30MB | L3 64MB |
Type DDR5 | Type LPDDR5X |
Max Memory 192GB | Max Memory 128GB |
ECC Yes | ECC No |
Channels 2 | Channels 4 |
Bus Width 128-bit | Bus Width 256-bit |
Speed 6400MT/s | Speed 8000MT/s |
Bandwidth 102.4GB/s | Bandwidth 256GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 102.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 256GB/s |
TDP 55W | TDP 65W |
cTDP-down 45W | cTDP-down 45W |
cTDP-up - | cTDP-up 120W |
Peak Power 160W | Peak Power - |
Max Operating Temp 105°C Max | Max Operating Temp 100°C Max |
Included Cooler - | Included Cooler 0 |
Bus Type DMI | Bus Type PCIe |
Bus Config 8 lanes | Bus Config 4 lanes |
Bus Speed 16GT/s | Bus Speed 16GT/s |
Bus Bandwidth 16GB/s | Bus Bandwidth 8GB/s |
PCIe PCIe 5.0 x2078.8GB/sBandwidth | PCIe PCIe 4.0 x1631.5GB/sBandwidth |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 512 | Shaders 2048 |
Boost Clock 2GHz | Boost Clock 2.8GHz |
·· 4.1 TFLOPSFP16 | ·· 22.94 TFLOPSFP16 |
NPU Model AI Boost 3 | NPU Model XDNA 2 |
NPU Cores 2 | NPU Cores 32 |
Performance 13 TOPSINT8 | Performance 50 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Arrow Lake-S - Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core | Codename Strix Halo EldoraDie - Zen 5P-Core - |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 6, 2025 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry TSMC |
Other Foundries TSMCiGPU TSMCIO TSMCSoC | Other Foundries - - TSMCSoC |
Fabrication Node N3B N5iGPU N6IO N6SoC | Fabrication Node N4X - - N5SoC |
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC | Die Size 141mm² - - - |
Transistor Count - | Transistor Count 16.6 Billion |
Transistor Density - | Transistor Density 118 MTr/mm² |
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