Intel Core Ultra 9 288V vs AMD Ryzen AI 9 HX 375 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 5.1GHz | 12 Cores(4P+8E) 24 Threads(8P+16E) 2GHz |
TDP 30W | TDP 28W |
Bandwidth 136.5GB/s LPDDR5X | Bandwidth 128GB/s · |
iGPU | iGPU |
·· 134.3 TFLOPSFP16 | ·· 11.88 TFLOPSFP16 |
Socket | Socket |
Core Ultra 9 288V2,889
Ryzen AI 9 HX 3752,9008 Cores 4P 4E | 12 Cores 4P 8E |
8 Threads 4P 4E | 24 Threads 8P 16E |
Base Clock 5.1GHz | Base Clock 2GHz |
Boost Clock - | Boost Clock 5.1GHz |
Overclocking Locked | Overclocking Locked |
L0i 64KB | L0i - |
L0d 48KB | L0d - |
L1i - 64KB E | L1i 32KB P - |
L1d 192KB P 32KB E | L1d 48KB P - |
L2 2.5MB P 4MB E shared | L2 1MB P - |
L3 12MB | L3 24MB |
Type LPDDR5X | Type · |
Max Memory 32GB | Max Memory 256GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8533MT/s | Speed 8000MT/s |
Bandwidth 136.5GB/s | Bandwidth 128GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 136.5GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 128GB/s |
TDP 30W | TDP 28W |
cTDP-down 17W | cTDP-down 15W |
cTDP-up - | cTDP-up 54W |
Peak Power 37W | Peak Power - |
Max Operating Temp 100°C Max | Max Operating Temp 100°C Max |
Included Cooler - | Included Cooler 0 |
Bus Type - | Bus Type PCIe |
Bus Config - | Bus Config 4 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 8GB/s |
PCIe PCIe 5.0 x415.8GB/sBandwidth | PCIe PCIe 4.0 x1631.5GB/sBandwidth |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 1024 | Shaders 1024 |
Boost Clock 2.05GHz | Boost Clock 2.9GHz |
·· 134.3 TFLOPSFP16 | ·· 11.88 TFLOPSFP16 |
NPU Model AI Boost 4 | NPU Model XDNA 2 |
NPU Cores 6 | NPU Cores 32 |
Performance 48 TOPSINT8 | Performance 55 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core | Codename Strix Point - - Zen 5P-Core Zen 5cE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Sep 3, 2024 | Release Date Jun 2, 2024 |
Foundry TSMC | Foundry TSMC |
Other Foundries IntelFIB TSMCIO | Other Foundries - |
Fabrication Node N3B 22nmFIB N6IO | Fabrication Node N4P - - |
Die Size 140mm² 46mm²IO | Die Size 233mm² - |
Transistor Count - | Transistor Count 28 Billion |
Transistor Density - | Transistor Density 120 MTr/mm² |
No images available
No images available
Laptops | Laptops - |