CPUs

Qualcomm Snapdragon 7s Gen 3 vs Apple A13 Bionic Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.5GHz
6 Cores(2P+4E)
6 Threads(2P+4E)
2.67GHz
TDP
-
TDP
5W
Bandwidth
25.6GB/s
LPDDR5
Bandwidth
34.1GB/s
LPDDR4X
iGPU
iGPU
··
1.07 TFLOPSFP16
··
629.8 GFLOPSFP16

8 Cores
1P
3M
4E
6 Cores
2P
-
4E
8 Threads
1P
3M
4E
6 Threads
2P
-
4E

Base Clock
2.5GHz
Base Clock
2.67GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
128KB P
-
96KB E
L1d
64KB P
64KB M
32KB E
L1d
128KB P
-
48KB E
L2
512KB P
512KB M
128KB E
-
-
L2
8MB P shared
4MB E shared
SLC Cache
1MB
SLC Cache
16MB

Type
LPDDR5
Type
LPDDR4X
Max Memory
16GB
Max Memory
4GB
ECC
No
ECC
No
Channels
2
Channels
1
Bus Width
32-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
4266MT/s
Bandwidth
25.6GB/s
Bandwidth
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s

TDP
-
TDP
5W

-
PCIe
PCIe 3.0 x5
4.9GB/sBandwidth

iGPU
iGPU
Shaders
256
Shaders
256
Boost Clock
1.05GHz
Boost Clock
1.23GHz
··
1.07 TFLOPSFP16
··
629.8 GFLOPSFP16

NPU Model
Hexagon
NPU Model
H12 Metis
NPU Cores
-
NPU Cores
8
NPU Clock
-
NPU Clock
1.32GHz
Performance
-
Performance
5.5 TOPSFP16

Modem Model
X63
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 5.0Gbps
Peak Down
-
Peak Up
Up to 1.6Gbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
KryoARMv9.2-A
Architecture
Family
Family
Branding
Snapdragon 7s Gen 3  branding
Branding
A13  branding
Codename
-
-
Cortex-A720P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Codename
Cebu
A13Variant
LightningP-Core
-
ThunderE-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Aug 1, 2024
Release Date
Sep 20, 2019

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N7P
Die Size
-
Die Size
98mm²
Transistor Count
-
Transistor Count
8.5 Billion
Transistor Density
-
Transistor Density
86 MTr/mm²