Qualcomm Snapdragon 8 Gen 2 vs MediaTek Dimensity 7350 Full Specs
8 Cores(1P+4M+3E) 8 Threads(1P+4M+3E) 3.2GHz | 8 Cores(2P+6E) 8 Threads(2P+6E) 3GHz |
TDP 5W | TDP - |
Bandwidth 67.2GB/s LPDDR5X | Bandwidth 51.2GB/s · |
iGPU | iGPU |
·· 4.18 TFLOPSFP16 | ·· 1.33 TFLOPSFP16 |
Snapdragon 8 Gen 21,666
Dimensity 73501,1958 Cores 1P 4M 3E | 8 Cores 2P - 6E |
8 Threads 1P 4M 3E | 8 Threads 2P - 6E |
Base Clock 3.2GHz | Base Clock 3GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P - 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P - 32KB E |
L2 1MB P 512KB M 128KB E | L2 1MB P - 128KB E |
L3 8MB | L3 4MB |
SLC Cache 4MB | SLC Cache - |
Type LPDDR5X | Type · |
Max Memory 24GB | Max Memory - |
ECC No | ECC No |
Channels 4 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 8400MT/s | Speed 6400MT/s |
Bandwidth 67.2GB/s | Bandwidth 51.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 67.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 51.2GB/s |
TDP 5W | TDP - |
iGPU | iGPU |
Shaders 1536 | Shaders 256 |
Boost Clock 680MHz | Boost Clock 1.3GHz |
·· 4.18 TFLOPSFP16 | ·· 1.33 TFLOPSFP16 |
NPU Model Hexagon | NPU Model MediaTek APU 657 |
Modem Model X70 | Modem Model MT 5G R2 |
Cellular 5G mmWave | Cellular 5G |
Peak Down Up to 10.0Gbps | Peak Down Up to 4.7Gbps |
Peak Up Up to 3.5Gbps | Peak Up Up to 900Mbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture KryoARMv9.0-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Snapdragon 8 Gen 2Variant Cortex-X3P-Core Cortex-A715M-Core Cortex-A510E-Core | Codename - Cortex-A715P-Core - Cortex-A510E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Oct 12, 2022 | Release Date Jul 1, 2024 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4 | Fabrication Node N4P |
Die Size 121mm² | Die Size - |
No images available
No images available
Smartphones | Smartphones |