AMD A10-9700E vs Apple A18 Pro (Neo) Full Specs

Summary

2 Cores 4 Threads 3GHz	6 Cores(2P+4E) 6 Threads(2P+4E) 4.04GHz
TDP 35W	TDP 5W
Bandwidth 38.4GB/s DDR4	Bandwidth 60GB/s LPDDR5X
iGPU Radeon R7 6CU 847MHz GCN 3	iGPU 5-Core A18 Pro
Peak·FP32·FP16 650.5 GFLOPSFP16	Peak·FP32·FP16 1.88 TFLOPSFP16
Socket AM4	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A10-9700E664

x1

A18 Pro (Neo)3,409

x5.13

Show Top Score

Core Config

2 Cores 2P -	6 Cores 2P 4E
4 Threads 4P -	6 Threads 2P 4E

Clocks

Base Clock 3GHz	Base Clock 4.04GHz
Boost Clock 3.5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 96KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 16MB P shared 4MB E shared
SLC Cache -	SLC Cache 24MB

Memory

Type DDR4	Type LPDDR5X
Max Memory 64GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 128-bit	Bus Width 64-bit
Speed 2400MT/s	Speed 7500MT/s
Bandwidth 38.4GB/s	Bandwidth 60GB/s
Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s	Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 60GB/s

Power & Thermals

TDP 35W	TDP 5W
Peak Power -	Peak Power 12W

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 8GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Radeon R7 6CU 847MHz GCN 3	iGPU 5-Core A18 Pro
Shaders 384	Shaders 640
Boost Clock 847MHz	Boost Clock 1.47GHz
Peak·FP32·FP16 650.5 GFLOPSFP16	Peak·FP32·FP16 1.88 TFLOPSFP16

NPU

NPU Model -	NPU Model H17 Theia
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.17GHz
Performance -	Performance 35 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Excavator+	Architecture Apple Silicon 14ARMv9.2-A
Family A Series	Family A Series
Branding	Branding
Codename Bristol Ridge - - -	Codename Tahiti A18 ProVariant AS14PP-Core AS14EE-Core
Market Segment Desktop	Market Segment Smartphone
Release Date Sep 5, 2016	Release Date Mar 4, 2026

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 28nm	Fabrication Node N3E
Die Size 250mm²	Die Size 110mm²
Transistor Count 3.1 Billion	Transistor Count 18.4 Billion
Transistor Density 12 MTr/mm²	Transistor Density 168 MTr/mm²

Images

No images available

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Used In

Laptops -

Laptops MacBook Neo(Early 2026)

Competitors

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