CPUs

AMD A4 PRO-3350B vs Apple A10X Fusion Full Specs

4 Cores
4 Threads
2GHz
6 Cores(3P+3E)
6 Threads(3P+3E)
2.36GHz
TDP
15W
TDP
8W
Bandwidth
25.6GB/s
DDR3
Bandwidth
51.2GB/s
LPDDR4
iGPU
iGPU
··
204.8 GFLOPSFP32
··
1.67 TFLOPSFP16
Socket
Socket
-

A4 PRO-3350BA4 PRO-3350B227
x1
A10X FusionA10X Fusion963
x4.24

4 Cores
4P
-
6 Cores
3P
3E
4 Threads
4P
-
6 Threads
3P
3E

Base Clock
2GHz
Base Clock
2.36GHz
Boost Clock
2.4GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
L1i
64KB P
32KB E
L1d
32KB P
-
L1d
64KB P
32KB E
L2
2MB P shared
-
L2
8MB P shared
1MB E shared
SLC Cache
-
SLC Cache
4MB

Type
DDR3
Type
LPDDR4
Max Memory
32GB
Max Memory
4GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
1600MT/s
Speed
3200MT/s
Bandwidth
25.6GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s

TDP
15W
TDP
8W

PCIe
PCIe 2.0 x8
4GB/sBandwidth
-

iGPU
iGPU
Shaders
128
Shaders
384
Boost Clock
800MHz
Boost Clock
1.09GHz
··
204.8 GFLOPSFP32
··
1.67 TFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
A4 2016 branding
Branding
A10X  branding
Codename
Carrizo-L
-
-
-
Codename
Myst
A10XVariant
HurricaneP-Core
ZephyrE-Core
Market Segment
Laptop
Market Segment
Tablet
Release Date
May 1, 2016
Release Date
Jun 13, 2017

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
10FF
Die Size
107mm²
Die Size
96mm²
Transistor Count
930 Million
Transistor Count
4 Billion
Transistor Density
9 MTr/mm²
Transistor Density
41 MTr/mm²

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