AMD EPYC 7302 vs Intel Xeon E7-8860 v3 Full Specs
16 Cores | 16 Cores |
32 Threads | 32 Threads |
Base Clock 3GHz | Base Clock 2.2GHz |
Boost Clock 3.3GHz | Boost Clock 3.2GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB | L1i 32KB |
L1d 32KB | L1d 32KB |
L2 512KB | L2 256KB |
L3 128MB | L3 40MB |
Type DDR4 | Type · |
Max Memory 4.1TB | Max Memory 1.54TB |
ECC Yes | ECC Yes |
Channels 8 | Channels 4 |
Bus Width 512-bit | Bus Width 256-bit |
Speed 3200MT/s | Speed 1866MT/s |
Bandwidth 204.8GB/s | Bandwidth 59.7GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
TDP 155W | TDP 140W |
Bus Type PCIe | Bus Type QPI |
Bus Config 8 lanes | Bus Config 16-bit |
Bus Speed 16GT/s | Bus Speed 9.6GT/s |
Bus Bandwidth 16GB/s | Bus Bandwidth 19.2GB/s |
PCIe PCIe 4.0 x128252GB/sBandwidth | PCIe PCIe 3.0 x3231.5GB/sBandwidth |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Rome Aspen HighlandsDie Rome 4CCDVariant | Codename Haswell-EP - Haswell-E-HCCVariant |
Market Segment Server | Market Segment Server |
Release Date Aug 7, 2019 | Release Date May 6, 2015 |
Foundry TSMC | Foundry Intel |
Other Foundries GlobalFoundriesIO | Other Foundries - |
Fabrication Node N7 12LPIO | Fabrication Node 22nm - |
Die Size 296mm² 416mm²IO | Die Size 662mm² - |
Transistor Count 15.2 Billion 8.3 BillionIO | Transistor Count 5.7 Billion - |
Transistor Density 51 MTr/mm² 20 MTr/mm²IO | Transistor Density 9 MTr/mm² - |
