CPUs

AMD Mobile Sempron 3000+ BX vs Qualcomm Snapdragon X2 Elite (X2E-80-100) Full Specs

1 Cores
1 Threads
1.8GHz
12 Cores(6P+6E)
12 Threads(6P+6E)
4GHz
TDP
62W
TDP
80W
Bandwidth
3.2GB/s
DDR
Bandwidth
152.4GB/s
LPDDR5X
iGPU
-
iGPU
··
-
··
10.44 TFLOPSFP16
Socket
Socket
-

Mobile Sempron 3000+ BXMobile Sempron 3000+ BX3.2GB/s
x1
Snapdragon X2 Elite (X2E-80-100)Snapdragon X2 Elite (X2E-80-100)152.4GB/s
x47.63

1 Cores
1P
-
12 Cores
6P
6E
1 Threads
1P
-
12 Threads
6P
6E

Base Clock
1.8GHz
Base Clock
4GHz
Boost Clock
-
Boost Clock
4.7GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
L1i
192KB P
128KB E
L1d
64KB P
-
L1d
96KB P
64KB E
L2
128KB P
-
-
L2
18MB P shared
12MB E shared

Type
DDR
Type
LPDDR5X
Max Memory
2GB
Max Memory
128GB
ECC
No
ECC
No
Channels
1
Channels
8
Bus Width
64-bit
Bus Width
128-bit
Speed
400MT/s
Speed
9523MT/s
Bandwidth
3.2GB/s
Bandwidth
152.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
3.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
152.4GB/s

TDP
62W
TDP
80W
Voltage Range
-
Voltage Range
-

Bus Type
HT
Bus Type
-
Bus Config
16-bit
Bus Config
-
Bus Speed
1.6GT/s
Bus Speed
-
Bus Bandwidth
3.2GB/s
Bus Bandwidth
-

-
PCIe
PCIe 5.0 x8
31.5GB/sBandwidth
-
PCIe Secondary
PCIe 4.0 x4
7.9GB/sBandwidth

iGPU
-
iGPU
Shaders
-
Shaders
1536
Boost Clock
-
Boost Clock
1.7GHz
··
-
··
10.44 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon
Performance
-
Performance
80 TOPSINT8

Manufacturer
Manufacturer
ISA
x86-32
ISA
AArch64
Architecture
Architecture
Oryon 3ARMv8.7-A
Family
Family
Branding
Sempron M 2004 branding
Branding
Snapdragon X2 Elite  branding
Codename
Albany
-
-
Codename
Glymur
Pegasus-PP-Core
Pegasus-EE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jul 15, 2005
Release Date
Sep 24, 2025

Foundry
AMD
Foundry
TSMC
Fabrication Node
90nm
Fabrication Node
N3E
Die Size
103mm²
Die Size
288mm²
Transistor Count
81 Million
Transistor Count
-
Transistor Density
1 MTr/mm²
Transistor Density
-

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