AMD Ryzen 3 5425C vs Qualcomm Snapdragon 8cx Gen 3 Full Specs

Summary

4 Cores 8 Threads 2.7GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 3GHz
TDP 15W	TDP -
Bandwidth 68.3GB/s LPDDR4X·DDR4	Bandwidth 68.3GB/s LPDDR4X
iGPU Radeon Vega 6 1600MHz	iGPU Adreno 695
Peak·FP32·FP16 2.46 TFLOPSFP16	Peak·FP32·FP16 7.37 TFLOPSFP16
Socket FP6	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 3 5425C1,520

x1

Snapdragon 8cx Gen 3-

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Show Top Score

Core Config

4 Cores 4P -	8 Cores 4P 4E
8 Threads 8P -	8 Threads 4P 4E

Clocks

Base Clock 2.7GHz	Base Clock 3GHz
Boost Clock 4.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 64KB P 64KB E
L1d 32KB P -	L1d 64KB P 64KB E
L2 512KB P -	L2 1MB P 512KB E
L3 8MB	L3 4MB
SLC Cache -	SLC Cache 3MB

Memory

Type LPDDR4X·DDR4	Type LPDDR4X
Max Memory 32GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 4266MT/s	Speed 4266MT/s
Bandwidth 68.3GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 68.3GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 68.3GB/s

Power & Thermals

TDP 15W	TDP -
Max Operating Temp 95°C Max	Max Operating Temp -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 8GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

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iGPU

iGPU Radeon Vega 6 1600MHz	iGPU Adreno 695
Shaders 384	Shaders 2048
Boost Clock 1.6GHz	Boost Clock 900MHz
Peak·FP32·FP16 2.46 TFLOPSFP16	Peak·FP32·FP16 7.37 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon
Performance -	Performance 29 TOPS

Cellular

Modem Model -	Modem Model X62
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 4.4Gbps
Peak Up -	Peak Up Up to 1.6Gbps

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 3	Architecture Kryo 680ARMv8.2-A
Family Ryzen 5000	Family 8c Series
Branding	Branding
Codename Barcelo - - -	Codename - Snapdragon 8cx Gen 3Variant Cortex-X1P-Core Cortex-A78E-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 4, 2022	Release Date Dec 22, 2021
Part Number -	Part Number SC8280
Official specs

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N7	Fabrication Node 5LPE
Die Size 180mm²	Die Size -
Transistor Count 10.7B	Transistor Count -
Transistor Density 59 MTr/mm²	Transistor Density -

Images