CPUs

AMD Ryzen 3 PRO 1200 vs Intel Xeon 6315P Full Specs

4 Cores
4 Threads
3.1GHz
4 Cores
4 Threads
2.8GHz
TDP
65W
TDP
55W
Bandwidth
42.7GB/s
DDR4
Bandwidth
76.8GB/s
DDR5
Socket
Socket

Ryzen 3 PRO 1200Ryzen 3 PRO 12001,077
x1
Xeon 6315PXeon 6315P-
-

4 Cores
4 Cores
4 Threads
4 Threads

Base Clock
3.1GHz
Base Clock
2.8GHz
Boost Clock
3.4GHz
Boost Clock
4.7GHz
Overclocking
Unlocked
Overclocking
Locked

L1i
64KB
L1i
64KB
L1d
32KB
L1d
48KB
L2
512KB
L2
2MB
L3
8MB
L3
12MB

Type
DDR4
Type
DDR5
Max Memory
64GB
Max Memory
128GB
ECC
Yes
ECC
Yes
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
2666MT/s
Speed
4800MT/s
Bandwidth
42.7GB/s
Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
42.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
76.8GB/s

TDP
65W
TDP
55W
Max Operating Temp
95°C Max
Max Operating Temp
-
Included Cooler
0
Included Cooler
-

Bus Type
PCIe
Bus Type
DMI
Bus Config
4 lanes
Bus Config
8 lanes
Bus Speed
8GT/s
Bus Speed
16GT/s
Bus Bandwidth
4GB/s
Bus Bandwidth
16GB/s

PCIe
PCIe 3.0 x20
19.7GB/sBandwidth
PCIe
PCIe 5.0 x20
78.8GB/sBandwidth

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 3 PRO 2017 branding
Branding
Xeon 2024 branding
Codename
Summit Ridge
ZeppelinDie
-
-
-
Codename
Granite Rapids-D
16Die
Granite Rapids-LCCVariant
Redwood CoveP-Core
4M-Core
Market Segment
Desktop
Market Segment
Server
Release Date
Jul 27, 2017
Release Date
Feb 24, 2025

Foundry
GlobalFoundries
Foundry
Intel
Other Foundries
-
Other Foundries
IntelIO
Fabrication Node
14LP
-
Fabrication Node
Intel 3
Intel 7IO
Die Size
213mm²
-
Die Size
-
482mm²IO
Transistor Count
4.8 Billion
Transistor Count
-
Transistor Density
23 MTr/mm²
Transistor Density
-

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