CPUs

AMD Ryzen 3 PRO 7330U vs Intel Core i3-7100E Full Specs

4 Cores
8 Threads
2.3GHz
2 Cores
4 Threads
2.9GHz
TDP
15W
TDP
35W
Bandwidth
68.3GB/s
·
Bandwidth
38.4GB/s
DDR4
iGPU
iGPU
··
2.77 TFLOPSFP16
··
364.8 GFLOPSFP16
Socket
Socket

Ryzen 3 PRO 7330URyzen 3 PRO 7330U1,637
x1.82
Core i3-7100ECore i3-7100E900
x1

4 Cores
2 Cores
8 Threads
4 Threads

Base Clock
2.3GHz
Base Clock
2.9GHz
Boost Clock
4.3GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
512KB
L2
256KB
L3
8MB
L3
3MB

Type
·
Type
DDR4
Max Memory
16GB
Max Memory
64GB
ECC
No
ECC
Yes
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
4266MT/s
Speed
2400MT/s
Bandwidth
68.3GB/s
Bandwidth
38.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
38.4GB/s

TDP
15W
TDP
35W
Max Operating Temp
95°C Max
Max Operating Temp
100°C Max
Included Cooler
-
Included Cooler
0

Bus Type
PCIe
Bus Type
DMI
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
8GT/s
Bus Speed
8GT/s
Bus Bandwidth
4GB/s
Bus Bandwidth
4GB/s

PCIe
PCIe 3.0 x16
15.8GB/sBandwidth
PCIe
PCIe 3.0 x16
15.8GB/sBandwidth

iGPU
iGPU
Shaders
384
Shaders
192
Boost Clock
1.8GHz
Boost Clock
950MHz
··
2.77 TFLOPSFP16
··
364.8 GFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 3 2017 branding
Branding
Core i3 2016 branding
Codename
Barcelo-R
-
Codename
Kaby Lake-H
Kaby Lake-2C-GT2Variant
Market Segment
Laptop
Market Segment
Embedded
Release Date
Jan 4, 2023
Release Date
Jan 3, 2017

Foundry
TSMC
Foundry
Intel
Fabrication Node
N7
Fabrication Node
14nm+
Die Size
180mm²
Die Size
103mm²
Transistor Count
10.7 Billion
Transistor Count
1.8 Billion
Transistor Density
59 MTr/mm²
Transistor Density
17 MTr/mm²

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