CPUs

AMD Ryzen 7 7435HS vs Qualcomm Snapdragon 7c+ Gen 3 Full Specs

8 Cores
16 Threads
3.1GHz
12 Cores(8P+4E)
12 Threads(8P+4E)
2.55GHz
TDP
45W
TDP
-
Bandwidth
76.8GB/s
DDR5
Bandwidth
25.6GB/s
·
iGPU
-
iGPU
··
-
··
844.8 GFLOPSFP16
Socket
Socket
-

8 Cores
8P
-
12 Cores
8P
4E
16 Threads
16P
-
12 Threads
8P
4E

Base Clock
3.1GHz
Base Clock
2.55GHz
Boost Clock
4.5GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
L1i
64KB P
32KB E
L1d
32KB P
-
L1d
64KB P
32KB E
L2
512KB P
-
L2
512KB P
128KB E
L3
16MB
L3
-

Type
DDR5
Type
·
Max Memory
64GB
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
32-bit
Speed
4800MT/s
Speed
6400MT/s
Bandwidth
76.8GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
25.6GB/s

TDP
45W
TDP
-
cTDP-down
35W
cTDP-down
-
cTDP-up
54W
cTDP-up
-
Max Operating Temp
95°C Max
Max Operating Temp
-

Bus Type
PCIe
Bus Type
-
Bus Config
4 lanes
Bus Config
-
Bus Speed
8GT/s
Bus Speed
-
Bus Bandwidth
4GB/s
Bus Bandwidth
-

PCIe
PCIe 4.0 x16
31.5GB/sBandwidth
-

iGPU
-
iGPU
Shaders
-
Shaders
256
Boost Clock
-
Boost Clock
825MHz
··
-
··
844.8 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon
Performance
-
Performance
6.5 TOPS

Modem Model
-
Modem Model
X53
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 3.7Gbps
Peak Up
-
Peak Up
Up to 2.9Gbps

Manufacturer
Manufacturer
ISA
x86-64
ISA
AArch64
Architecture
Architecture
KryoARMv8.2-A
Family
Family
Branding
Ryzen 7 2017 branding
Branding
Snapdragon 7c Plus Gen 3  branding
Codename
Rembrandt-R
-
-
Codename
-
Cortex-A78P-Core
Cortex-A55E-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Nov 1, 2023
Release Date
Dec 22, 2021

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N6
Die Size
210mm²
Die Size
-
Transistor Count
13.1 Billion
Transistor Count
-
Transistor Density
62 MTr/mm²
Transistor Density
-