AMD Ryzen 9 9850HX vs Qualcomm Snapdragon X2 Elite (X2E-80-100) Full Specs

Summary

12 Cores 24 Threads 3GHz	12 Cores(6P+6E) 12 Threads(6P+6E) 4GHz
TDP 65W	TDP 80W
Bandwidth 89.6GB/s DDR5	Bandwidth 152.4GB/s LPDDR5X
iGPU Radeon 610M 2200MHz	iGPU Adreno X2-85 5.2T
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16
Socket FL1	Socket -

Highlights

Max Bandwidth

Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 9 9850HX89.6GB/s

x1

Snapdragon X2 Elite (X2E-80-100)152.4GB/s

x1.70

Core Config

12 Cores 12P -	12 Cores 6P 6E
24 Threads 24P -	12 Threads 6P 6E

Clocks

Base Clock 3GHz	Base Clock 4GHz
Boost Clock 5.2GHz	Boost Clock 4.7GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 96KB P 64KB E
L2 1MB P - -	L2 18MB P shared 12MB E shared
L3 64MB	L3 -

Memory

Type DDR5	Type LPDDR5X
Max Memory 96GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 5600MT/s	Speed 9523MT/s
Bandwidth 89.6GB/s	Bandwidth 152.4GB/s
Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 152.4GB/s

Power & Thermals

TDP 65W	TDP 80W
cTDP-down 45W	cTDP-down -
cTDP-up 75W	cTDP-up -
Max Operating Temp 95°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 32GT/s	Bus Speed -
Bus Bandwidth 32GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x24 94.5GB/sBandwidth	PCIe PCIe 5.0 x8 31.5GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Radeon 610M 2200MHz	iGPU Adreno X2-85 5.2T
Shaders 128	Shaders 1536
Boost Clock 2.2GHz	Boost Clock 1.7GHz
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon
Performance -	Performance 80 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Oryon 3ARMv8.7-A
Family Ryzen 9000	Family X Series
Branding	Branding
Codename Fire Range EldoraDie Fire Range 2CCDVariant Zen 5P-Core -	Codename Glymur - - Pegasus-PP-Core Pegasus-EE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Sep 24, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCIO	Other Foundries -
Fabrication Node N4X N6IO	Fabrication Node N3E -
Die Size 141mm² 122mm²IO	Die Size 288mm² -
Transistor Count 16.6 Billion 3.4 BillionIO	Transistor Count -
Transistor Density 118 MTr/mm² 28 MTr/mm²IO	Transistor Density -

Images

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Competitors

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QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU QualcommSnapdragon X2 Elite Extreme (X2E-96-100) QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU QualcommSnapdragon X2 Elite (X2E-88-100) QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU IntelCore Ultra 5 245HX Show 12 more