AMD Ryzen AI 7 PRO 350 vs Intel Core i3-1000NG4 Full Specs

Summary

8 Cores(4P+4E) 16 Threads(8P+8E) 2GHz	2 Cores 4 Threads 1.1GHz
TDP 28W	TDP 9W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 59.7GB/s LPDDR4
iGPU Radeon 860M 3000MHz	iGPU Iris Plus 48EU 900MHz
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 1.38 TFLOPSFP16
Socket FP8	Socket BGA 1377

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 7 PRO 350-

-

Core i3-1000NG41,126

x1

Show Top Score

Core Config

8 Cores 4P 4E	2 Cores 2P -
16 Threads 8P 8E	4 Threads 4P -

Clocks

Base Clock 2GHz	Base Clock 1.1GHz
Boost Clock 5GHz	Boost Clock 3.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 48KB P	L1d 48KB P
L2 1MB P	L2 512KB P
L3 16MB	L3 4MB

Memory

Type LPDDR5X·DDR5	Type LPDDR4
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 3733MT/s
Bandwidth 128GB/s	Bandwidth 59.7GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s

Power & Thermals

TDP 28W	TDP 9W
cTDP-down 15W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 4GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

iGPU

iGPU Radeon 860M 3000MHz	iGPU Iris Plus 48EU 900MHz
Shaders 384	Shaders 384
Boost Clock 3GHz	Boost Clock 900MHz
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 1.38 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model GNA 1.0
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Controller

Controller Model -	Controller Model 495 Series Y+
Codename -	Codename Ice Lake
PCIe -	PCIe -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Ice Lake
Family Ryzen AI 300	Family Core 10th Gen
Branding	Branding
Codename Strix Point Zen 5P-Core Zen 5cE-Core	Codename Ice Lake-Y Sunny CoveP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Mar 18, 2020

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node N4P -	Fabrication Node 10nm+ 14nmPCH
Die Size 233mm² -	Die Size 122mm² 54mm²PCH
Transistor Count 28 Billion	Transistor Count 7 Billion
Transistor Density 120 MTr/mm²	Transistor Density 57 MTr/mm²

Images

No images available

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Used In

Laptops -

Laptops MacBook Air 13(Early 2020)

Competitors

AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen AI 7 350 AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen 9 270 AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen 7 250 Show 12 more

IntelCore i3-1000NG4 vs CPU AMDRyzen AI 5 PRO 340 IntelCore i3-1000NG4 vs CPU AMDRyzen AI 5 340 IntelCore i3-1000NG4 vs CPU AMDRyzen AI 7 350 Show 6 more