AMD Ryzen AI 9 HX 375 vs Intel Core Ultra 7 265U Full Specs
12 Cores(4P+8E) 24 Threads(8P+16E) 2GHz | 12 Cores(2P+8M+2E) 14 Threads(4P+8M+2E) 2.1GHz |
TDP 28W | TDP 15W |
Bandwidth 128GB/s · | Bandwidth 134.4GB/s · |
iGPU | iGPU |
·· 11.88 TFLOPSFP16 | ·· 4.3 TFLOPSFP16 |
Socket | Socket |
Ryzen AI 9 HX 3752,900
Core Ultra 7 265U2,55112 Cores 4P - 8E | 12 Cores 2P 8M 2E |
24 Threads 8P - 16E | 14 Threads 4P 8M 2E |
Base Clock 2GHz | Base Clock 2.1GHz |
Boost Clock 5.1GHz | Boost Clock 5.3GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB P - - | L1i 64KB P 64KB M 64KB E |
L1d 48KB P - - | L1d 48KB P 32KB M 32KB E |
L2 1MB P - - | L2 3MB P 8MB M shared 8MB E shared |
L3 24MB | L3 36MB |
Type · | Type · |
Max Memory 256GB | Max Memory 96GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8000MT/s | Speed 8400MT/s |
Bandwidth 128GB/s | Bandwidth 134.4GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 128GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 134.4GB/s |
TDP 28W | TDP 15W |
cTDP-down 15W | cTDP-down 12W |
cTDP-up 54W | cTDP-up - |
Peak Power - | Peak Power 57W |
Max Operating Temp 100°C Max | Max Operating Temp 110°C Max |
Included Cooler 0 | Included Cooler - |
Bus Type PCIe | Bus Type - |
Bus Config 4 lanes | Bus Config - |
Bus Speed 16GT/s | Bus Speed - |
Bus Bandwidth 8GB/s | Bus Bandwidth - |
PCIe PCIe 4.0 x1631.5GB/sBandwidth | PCIe PCIe 4.0 x2039.4GB/sBandwidth |
iGPU | iGPU |
Shaders 1024 | Shaders 512 |
Boost Clock 2.9GHz | Boost Clock 2.1GHz |
·· 11.88 TFLOPSFP16 | ·· 4.3 TFLOPSFP16 |
NPU Model XDNA 2 | NPU Model AI Boost 3 |
NPU Cores 32 | NPU Cores 2 |
Performance 55 TOPSINT8 | Performance 13 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Strix Point - Zen 5P-Core - Zen 5cE-Core | Codename Arrow Lake-U Arrow Lake-U-2P-8EVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 2, 2024 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries TSMCiGPU TSMCIO TSMCSoC |
Fabrication Node N4P - - - | Fabrication Node Intel 3 N5iGPU N6IO N6SoC |
Die Size 233mm² - - - | Die Size - 23mm²iGPU 10mm²IO 100mm²SoC |
Transistor Count 28 Billion | Transistor Count - |
Transistor Density 120 MTr/mm² | Transistor Density - |
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