AMD Ryzen AI 9 HX 375 vs Intel Core Ultra 9 288V Full Specs

Summary

12 Cores(4P+8E) 24 Threads(8P+16E) 2GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 5.1GHz
TDP 28W	TDP 30W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 136.5GB/s LPDDR5X
iGPU Radeon 890M 2900MHz	iGPU Arc 140V 2050MHz
Peak·FP32·FP16 11.88 TFLOPSFP16	Peak·FP32·FP16 134.3 TFLOPSFP16
Socket FP8	Socket BGA 2833

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 9 HX 3752,900

x1.00

Core Ultra 9 288V2,889

x1

Show Top Score

Core Config

12 Cores 4P 8E	8 Cores 4P 4E
24 Threads 8P 16E	8 Threads 4P 4E

Clocks

Base Clock 2GHz	Base Clock 5.1GHz
Boost Clock 5.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L0i -	L0i 64KB
L0d -	L0d 48KB
L1i 32KB P -	L1i - 64KB E
L1d 48KB P -	L1d 192KB P 32KB E
L2 1MB P -	L2 2.5MB P 4MB E shared
L3 24MB	L3 12MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 8533MT/s
Bandwidth 128GB/s	Bandwidth 136.5GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 136.5GB/s

Power & Thermals

TDP 28W	TDP 30W
cTDP-down 15W	cTDP-down 17W
cTDP-up 54W	cTDP-up -
Peak Power -	Peak Power 37W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x4 15.8GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Radeon 890M 2900MHz	iGPU Arc 140V 2050MHz
Shaders 1024	Shaders 1024
Boost Clock 2.9GHz	Boost Clock 2.05GHz
Peak·FP32·FP16 11.88 TFLOPSFP16	Peak·FP32·FP16 134.3 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model AI Boost 4
NPU Cores 32	NPU Cores 6
Performance 55 TOPSINT8	Performance 48 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Lunar Lake
Family Ryzen AI 300	Family Core Ultra Series 2
Branding	Branding
Codename Strix Point - - Zen 5P-Core Zen 5cE-Core	Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jun 2, 2024	Release Date Sep 3, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries IntelFIB TSMCIO
Fabrication Node N4P - -	Fabrication Node N3B 22nmFIB N6IO
Die Size 233mm² -	Die Size 140mm² 46mm²IO
Transistor Count 28 Billion	Transistor Count -
Transistor Density 120 MTr/mm²	Transistor Density -

Images

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Used In

Laptops -

Laptops XPS 13(9350, Late 2024)

Competitors

AMDRyzen AI 9 HX 375 vs CPU AMDRyzen 7 250 AMDRyzen AI 9 HX 375 vs CPU AMDRyzen 7 260 AMDRyzen AI 9 HX 375 vs CPU AMDRyzen 3 210 Show 12 more

IntelCore Ultra 9 288V vs CPU IntelCore Ultra 5 235U IntelCore Ultra 9 288V vs CPU IntelCore Ultra 5 225U IntelCore Ultra 9 288V vs CPU IntelCore Ultra 7 265U Show 12 more