AMD Ryzen AI Max 385 vs AMD Ryzen AI Max+ 395 Full Specs

Summary

8 Cores 16 Threads 3.6GHz	16 Cores 32 Threads 3GHz
TDP 65W	TDP 65W
Bandwidth 256GB/s LPDDR5X	Bandwidth 256GB/s LPDDR5X
iGPU Radeon 8050S	iGPU Radeon 8060S
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 29.7 TFLOPSFP16
Socket FP11	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 385-

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Ryzen AI Max+ 3952,984

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Show Top Score

Core Config

8 Cores	16 Cores
16 Threads	32 Threads

Clocks

Base Clock 3.6GHz	Base Clock 3GHz
Boost Clock 5GHz	Boost Clock 5.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 48KB	L1d 48KB
L2 1MB	L2 1MB
L3 32MB	L3 64MB

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 256-bit	Bus Width 256-bit
Speed 8000MT/s	Speed 8000MT/s
Bandwidth 256GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 65W	TDP 65W
cTDP-down 45W	cTDP-down 45W
cTDP-up 120W	cTDP-up 120W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU Radeon 8060S
Shaders 2048	Shaders 2560
Boost Clock 2.8GHz	Boost Clock 2.9GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 29.7 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model XDNA 2
NPU Cores 32	NPU Cores 32
Performance 50 TOPSINT8	Performance 50 TOPSINT8

Chip

Manufacturer AMD	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Zen 5
Family Ryzen AI 300	Family Ryzen AI 300
Branding	Branding
Codename Strix Halo EldoraDie Zen 5P-Core	Codename Strix Halo EldoraDie Zen 5P-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries TSMCSoC
Fabrication Node N4X N5SoC	Fabrication Node N4X N5SoC
Die Size 71mm²	Die Size 141mm²
Transistor Count 8.3 Billion	Transistor Count 16.6 Billion
Transistor Density 118 MTr/mm²	Transistor Density 118 MTr/mm²

Images

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Used In

Desktops Framework Desktop(Early 2025)

Desktops Framework Desktop(Early 2025)

Competitors

AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 385 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 380 Show 12 more

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 385 Show 12 more