AMD Ryzen AI Max 385 vs Apple A12Z Bionic Full Specs

Summary

8 Cores 16 Threads 3.6GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.49GHz
TDP 65W	TDP 8W
Bandwidth 256GB/s LPDDR5X	Bandwidth 68.3GB/s LPDDR4X
iGPU Radeon 8050S	iGPU 8-Core A12Z
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 1.12 TFLOPSFP16
Socket FP11	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 385-

-

A12Z Bionic1,346

x1

Show Top Score

Core Config

8 Cores 8P -	8 Cores 4P 4E
16 Threads 16P -	8 Threads 4P 4E

Clocks

Base Clock 3.6GHz	Base Clock 2.49GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 128KB P 48KB E
L1d 48KB P -	L1d 128KB P 32KB E
L2 1MB P - -	L2 8MB P shared 2MB E shared
L3 32MB	L3 -
SLC Cache -	SLC Cache 8MB

Memory

Type LPDDR5X	Type LPDDR4X
Max Memory 128GB	Max Memory 6GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 4266MT/s
Bandwidth 256GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 68.3GB/s

Power & Thermals

TDP 65W	TDP 8W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU 8-Core A12Z
Shaders 2048	Shaders 512
Boost Clock 2.8GHz	Boost Clock 1.1GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 1.12 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H11 Pontus
NPU Cores 32	NPU Cores 8
NPU Clock -	NPU Clock 1.26GHz
Performance 50 TOPSINT8	Performance 5 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 8ARMv8.3-A
Family Ryzen AI 300	Family A Series
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core -	Codename Aruba - A12ZVariant VortexP-Core TempestE-Core
Market Segment Laptop	Market Segment Tablet
Release Date Jan 6, 2025	Release Date Mar 25, 2020

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node N7 -
Die Size 71mm²	Die Size 135mm²
Transistor Count 8.3 Billion	Transistor Count 10 Billion
Transistor Density 118 MTr/mm²	Transistor Density 74 MTr/mm²

Images

No images available

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Used In

Desktops Framework Desktop(Early 2025)	Desktops Mac mini(DTK, Mid 2020)
Tablets -	Tablets iPad Pro 11" Gen 2(A12Z, Early 2020)iPad Pro 12.9" Gen 4(A12Z, Early 2020)

Competitors

AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 385 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max 390 Show 12 more

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