AMD Ryzen AI Max 385 vs Apple M3 Ultra (28C60G) Full Specs

Summary

8 Cores 16 Threads 3.6GHz	28 Cores(20P+8E) 28 Threads(20P+8E) 4.05GHz
TDP 65W	TDP 300W
Bandwidth 256GB/s LPDDR5X	Bandwidth 819.2GB/s LPDDR5
iGPU Radeon 8050S	iGPU 60-Core M3 Ultra
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 21.2 TFLOPSFP16
Socket FP11	Socket -

Core Config

8 Cores 8P -	28 Cores 20P 8E
16 Threads 16P -	28 Threads 20P 8E

Clocks

Base Clock 3.6GHz	Base Clock 4.05GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 64MB P shared 4MB E shared
L3 32MB	L3 -
SLC Cache -	SLC Cache 96MB

Memory

Type LPDDR5X	Type LPDDR5
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 1024-bit
Speed 8000MT/s	Speed 6400MT/s
Bandwidth 256GB/s	Bandwidth 819.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s UC·Spec·OC 256GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 819.2GB/s

Power & Thermals

TDP 65W	TDP 300W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x32 63GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU 60-Core M3 Ultra
Shaders 2048	Shaders 7680
Boost Clock 2.8GHz	Boost Clock 1.38GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 21.2 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H15 Erebus
NPU Cores 32	NPU Cores 32
NPU Clock -	NPU Clock 2.36GHz
Performance 50 TOPSINT8	Performance 36 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 13ARMv8.6-A
Family Ryzen AI 300	Family M Series
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core -	Codename Palma-D - M3 UltraVariant EverestP-Core Sawtooth E-Core
Market Segment Laptop	Market Segment Workstation
Release Date Jan 6, 2025	Release Date Mar 5, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node N3B -
Die Size 71mm²	Die Size 954mm²
Transistor Count 8.3 Billion	Transistor Count 184 Billion
Transistor Density 118 MTr/mm²	Transistor Density 193 MTr/mm²

Images

Used In

Desktops Framework Desktop(Early 2025)

Desktops Mac Studio(M3 Ultra, Early 2025)

Competitors

AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 385 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 380 Show 12 more

AppleM3 Ultra (28C60G) vs CPU AppleM2 Ultra (24C60G) AppleM3 Ultra (28C60G) vs CPU AppleM2 Ultra (24C76G) AppleM3 Ultra (28C60G) vs CPU AppleM3 Ultra (32C80G) Show 12 more