CPUs

AMD Ryzen AI Max 385 vs Intel Core 2 Extreme X7900 Full Specs

8 Cores
16 Threads
3.6GHz
2 Cores
2 Threads
2.8GHz
TDP
65W
TDP
44W
Bandwidth
256GB/s
LPDDR5X
Bandwidth
-
iGPU
iGPU
-
··
22.94 TFLOPSFP16
··
-
Socket
Socket

Ryzen AI Max 385Ryzen AI Max 385-
-
Core 2 Extreme X7900Core 2 Extreme X7900331
x1

8 Cores
2 Cores
16 Threads
2 Threads

Base Clock
3.6GHz
Base Clock
2.8GHz
Boost Clock
5GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Unlocked

L1i
32KB
L1i
32KB
L1d
48KB
L1d
32KB
L2
1MB
L2
4MB shared
L3
32MB
L3
-

Type
LPDDR5X
Type
-
Max Memory
128GB
Max Memory
-
ECC
No
ECC
-
Channels
4
Channels
-
Bus Width
256-bit
Bus Width
-
Speed
8000MT/s
Speed
-
Bandwidth
256GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
256GB/s
Bandwidth Calculator
-

TDP
65W
TDP
44W
cTDP-down
45W
cTDP-down
-
cTDP-up
120W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max
Voltage Range
-
Voltage Range
-
Included Cooler
0
Included Cooler
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
64-bit
Bus Speed
16GT/s
Bus Speed
800MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
6.4GB/s

PCIe
PCIe 4.0 x16
31.5GB/sBandwidth
-

iGPU
iGPU
-
Shaders
2048
Shaders
-
Boost Clock
2.8GHz
Boost Clock
-
··
22.94 TFLOPSFP16
··
-

NPU Model
XDNA 2
NPU Model
-
NPU Cores
32
NPU Cores
-
Performance
50 TOPSINT8
Performance
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen AI Max 2024 branding
Branding
Core 2 Extreme 2006 branding
Codename
Strix Halo
EldoraDie
Zen 5P-Core
Codename
Merom XE
-
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Aug 1, 2007

Foundry
TSMC
Foundry
Intel
Other Foundries
TSMCSoC
Other Foundries
-
Fabrication Node
N4X
N5SoC
Fabrication Node
65nm
-
Die Size
71mm²
Die Size
143mm²
Transistor Count
8.3 Billion
Transistor Count
291 Million
Transistor Density
118 MTr/mm²
Transistor Density
2 MTr/mm²

No images available
No images available

Desktops
Desktops
-
All-in-Ones
-
All-in-Ones