AMD Ryzen AI Max 385 vs Intel Core Ultra 7 355 Full Specs

Summary

8 Cores 16 Threads 3.6GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.3GHz
TDP 65W	TDP 25W
Bandwidth 256GB/s LPDDR5X	Bandwidth 108.8GB/s LPDDR5X·DDR5
iGPU Radeon 8050S	iGPU Graphics 4C 2500MHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 81.92 TFLOPSFP16
Socket FP11	Socket BGA 2540

Highlights

E-Core Boost

E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 385-

-

Core Ultra 7 3553.5GHz

x1

Core Config

8 Cores 8P -	8 Cores 4P 4E
16 Threads 16P -	8 Threads 4P 4E

Clocks

Base Clock 3.6GHz	Base Clock 2.3GHz
Boost Clock 5GHz	Boost Clock 4.7GHz
Overclocking Locked	Overclocking Locked

Cache

L0i -	L0i 64KB
L0d -	L0d 48KB
L1i 32KB P -	L1i - 64KB E
L1d 48KB P -	L1d 192KB P 32KB E
L2 1MB P -	L2 3MB P 4MB E shared
L3 32MB	L3 12MB

Memory

Type LPDDR5X	Type LPDDR5X·DDR5
Max Memory 128GB	Max Memory 96GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 6800MT/s
Bandwidth 256GB/s	Bandwidth 108.8GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate6800MT/s Calculated Bandwidth 108.8GB/s

Power & Thermals

TDP 65W	TDP 25W
cTDP-down 45W	cTDP-down 12W
cTDP-up 120W	cTDP-up -
Peak Power -	Peak Power 55W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x4 15.8GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x8 15.8GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU Graphics 4C 2500MHz
Shaders 2048	Shaders 512
Boost Clock 2.8GHz	Boost Clock 2.5GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 81.92 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model NPU 5
NPU Cores 32	NPU Cores 3
Performance 50 TOPSINT8	Performance 49 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Panther Lake
Family Ryzen AI 300	Family Core Ultra Series 3
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core - -	Codename Panther Lake-U - Panther Lake-U-4P-4EVariant Cougar CoveP-Core DarkmontM-Core DarkmontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries - - TSMCSoC	Other Foundries InteliGPU TSMCPCH -
Fabrication Node N4X - - N5SoC	Fabrication Node Intel 18A Intel 3iGPU N6PCH -
Die Size 71mm² - -	Die Size 93mm² 27mm²iGPU 49mm²PCH
Transistor Count 8.3 Billion -	Transistor Count - 4 MillionPCH
Transistor Density 118 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Desktops Framework Desktop(Early 2025)

Desktops -

Competitors

AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 385 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 380 Show 12 more

IntelCore Ultra 7 355 vs CPU IntelCore Ultra 7 365 IntelCore Ultra 7 355 vs CPU IntelCore Ultra 5 325 IntelCore Ultra 7 355 vs CPU IntelCore Ultra 5 335 Show 12 more