AMD Ryzen AI Max 390 vs Qualcomm Snapdragon X Elite (X1E-78-100) Full Specs

Summary

12 Cores 24 Threads 3.2GHz	12 Cores 12 Threads 3.4GHz
TDP 65W	TDP 80W
Bandwidth 256GB/s LPDDR5X	Bandwidth 135.2GB/s LPDDR5X
iGPU Radeon 8050S	iGPU Adreno X1 3.8T
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16
Socket FP11	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 3902,835

x1.19

Snapdragon X Elite (X1E-78-100)2,389

x1

Show Top Score

Core Config

12 Cores	12 Cores
24 Threads	12 Threads

Clocks

Base Clock 3.2GHz	Base Clock 3.4GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 192KB
L1d 48KB	L1d 96KB
L2 1MB	L2 36MB shared
L3 64MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 128GB	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 8448MT/s
Bandwidth 256GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 65W	TDP 80W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU Adreno X1 3.8T
Shaders 2048	Shaders 1536
Boost Clock 2.8GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model Hexagon
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance 45 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture OryonARMv8.7-A
Family Ryzen AI 300	Family X Series
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core	Codename Hamoa - Snapdragon X EliteVariant PhoenixP-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Apr 24, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node N4P -
Die Size 141mm²	Die Size 170mm²
Transistor Count 16.6 Billion	Transistor Count -
Transistor Density 118 MTr/mm²	Transistor Density -

Images

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Competitors

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