AMD Ryzen AI Max 390 vs Qualcomm Snapdragon X Elite (X1E-84-100) Full Specs

Summary

12 Cores 24 Threads 3.2GHz	12 Cores 12 Threads 3.8GHz
TDP 65W	TDP 80W
Bandwidth 256GB/s LPDDR5X	Bandwidth 135.2GB/s LPDDR5X
iGPU Radeon 8050S	iGPU Adreno X1 4.6T
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 9.22 TFLOPSFP16
Socket FP11	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 3902,835

x1

Snapdragon X Elite (X1E-84-100)2,850

x1.01

Show Top Score

Core Config

12 Cores	12 Cores
24 Threads	12 Threads

Clocks

Base Clock 3.2GHz	Base Clock 3.8GHz
Boost Clock 5GHz	Boost Clock 4.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 192KB
L1d 48KB	L1d 96KB
L2 1MB	L2 36MB shared
L3 64MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 128GB	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 8448MT/s
Bandwidth 256GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 65W	TDP 80W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU Adreno X1 4.6T
Shaders 2048	Shaders 1536
Boost Clock 2.8GHz	Boost Clock 1.5GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 9.22 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model Hexagon
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance 45 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture OryonARMv8.7-A
Family Ryzen AI 300	Family X Series
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core	Codename Hamoa - Snapdragon X EliteVariant PhoenixP-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Apr 24, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node N4P -
Die Size 141mm²	Die Size 170mm²
Transistor Count 16.6 Billion	Transistor Count -
Transistor Density 118 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Laptops -	Laptops Surface Laptop 7 13(Mid 2024)Surface Laptop 7 15(Mid 2024)Galaxy Book4 Edge 16(Late 2024)
Tablets -	Tablets Surface Pro 11(X Elite, Mid 2024)

Competitors

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