AMD Ryzen AI Max 390 vs Qualcomm Snapdragon X2 Elite (X2E-80-100) Full Specs

Summary

12 Cores 24 Threads 3.2GHz	12 Cores(6P+6E) 12 Threads(6P+6E) 4GHz
TDP 65W	TDP 80W
Bandwidth 256GB/s LPDDR5X	Bandwidth 152.4GB/s LPDDR5X
iGPU Radeon 8050S	iGPU Adreno X2-85 5.2T
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16
Socket FP11	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 3902,835

x1

Snapdragon X2 Elite (X2E-80-100)-

-

Show Top Score

Core Config

12 Cores 12P -	12 Cores 6P 6E
24 Threads 24P -	12 Threads 6P 6E

Clocks

Base Clock 3.2GHz	Base Clock 4GHz
Boost Clock 5GHz	Boost Clock 4.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 96KB P 64KB E
L2 1MB P - -	L2 18MB P shared 12MB E shared
L3 64MB	L3 -

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 9523MT/s
Bandwidth 256GB/s	Bandwidth 152.4GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 152.4GB/s

Power & Thermals

TDP 65W	TDP 80W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x8 31.5GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU Adreno X2-85 5.2T
Shaders 2048	Shaders 1536
Boost Clock 2.8GHz	Boost Clock 1.7GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model Hexagon
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance 80 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Oryon 3ARMv8.7-A
Family Ryzen AI 300	Family X Series
Branding	Branding
Codename Strix Halo EldoraDie Zen 5P-Core -	Codename Glymur - Pegasus-PP-Core Pegasus-EE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Sep 24, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node N3E -
Die Size 141mm²	Die Size 288mm²
Transistor Count 16.6 Billion	Transistor Count -
Transistor Density 118 MTr/mm²	Transistor Density -

Images

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Competitors

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