AMD Ryzen AI Max+ 395 vs Intel Celeron 4205U Full Specs

Summary

16 Cores 32 Threads 3GHz	2 Cores 2 Threads 1.8GHz
TDP 65W	TDP 15W
Bandwidth 256GB/s LPDDR5X	Bandwidth 34.1GB/s DDR4·LPDDR3
iGPU Radeon 8060S	iGPU UHD 610 900MHz
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 172.8 GFLOPSFP16
Socket FP11	Socket BGA 1528

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max+ 3952,984

x8.83

Celeron 4205U338

x1

Show Top Score

Core Config

16 Cores	2 Cores
32 Threads	2 Threads

Clocks

Base Clock 3GHz	Base Clock 1.8GHz
Boost Clock 5.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 48KB	L1d 32KB
L2 1MB	L2 256KB
L3 64MB	L3 2MB

Memory

Type LPDDR5X	Type DDR4·LPDDR3
Max Memory 128GB	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 2133MT/s
Bandwidth 256GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate2133MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 65W	TDP 15W
cTDP-down 45W	cTDP-down 13W
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 4GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 2.0 x12 6GB/sBandwidth

iGPU

iGPU Radeon 8060S	iGPU UHD 610 900MHz
Shaders 2560	Shaders 96
Boost Clock 2.9GHz	Boost Clock 900MHz
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 172.8 GFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model -
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Skylake
Family Ryzen AI 300	Family Celeron
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core	Codename Whiskey Lake-U - Whiskey Lake-2CVariant -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 1, 2019

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node 14nm+ -
Die Size 141mm²	Die Size 103mm²
Transistor Count 16.6 Billion	Transistor Count 1.8 Billion
Transistor Density 118 MTr/mm²	Transistor Density 17 MTr/mm²

Images

No images available

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Used In

Desktops Framework Desktop(Early 2025)

Desktops -

Competitors

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 385 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 380 Show 12 more

IntelCeleron 4205U vs CPU AMDRyzen AI 7 PRO 350 IntelCeleron 4205U vs CPU AMDRyzen AI 5 340 IntelCeleron 4205U vs CPU AMDRyzen AI 7 350 Show 12 more