AMD Ryzen AI Max+ 395 vs Intel Core i9-12900HK Full Specs

Summary

16 Cores 32 Threads 3GHz	14 Cores(6P+8E) 20 Threads(12P+8E) 2.5GHz
TDP 65W	TDP 45W
Bandwidth 256GB/s LPDDR5X	Bandwidth 83.2GB/s LPDDR5·DDR5·LPDDR4X·DDR4
iGPU Radeon 8060S	iGPU Iris Xe 96EU 1450MHz
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 4.45 TFLOPSFP16
Socket FP11	Socket BGA 1744

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max+ 3952,984

x1.32

Core i9-12900HK2,258

x1

Show Top Score

Core Config

16 Cores 16P -	14 Cores 6P 8E
32 Threads 32P -	20 Threads 12P 8E

Clocks

Base Clock 3GHz	Base Clock 2.5GHz
Boost Clock 5.1GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 32KB P -	L1i 32KB P 64KB E
L1d 48KB P -	L1d 48KB P 32KB E
L2 1MB P -	L2 1.25MB P 4MB E shared
L3 64MB	L3 24MB

Memory

Type LPDDR5X	Type LPDDR5·DDR5·LPDDR4X·DDR4
Max Memory 128GB	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 5200MT/s
Bandwidth 256GB/s	Bandwidth 83.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s

Power & Thermals

TDP 65W	TDP 45W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Peak Power -	Peak Power 115W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 16GT/s	Bus Speed 4GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Radeon 8060S	iGPU Iris Xe 96EU 1450MHz
Shaders 2560	Shaders 768
Boost Clock 2.9GHz	Boost Clock 1.45GHz
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 4.45 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model GNA 3.0
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Controller

Controller Model -	Controller Model 600 Series P+
Codename -	Codename Alder Lake
PCIe -	PCIe -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Alder Lake
Family Ryzen AI 300	Family Core 12th Gen
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core -	Codename Alder Lake-H - Alder Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 18, 2022

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries - TSMCSoC	Other Foundries IntelPCH -
Fabrication Node N4X - N5SoC	Fabrication Node Intel 7 14nmPCH -
Die Size 141mm² -	Die Size 208mm² 54mm²PCH
Transistor Count 16.6 Billion	Transistor Count 15.2 Billion
Transistor Density 118 MTr/mm²	Transistor Density 73 MTr/mm²

Images

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Used In

Laptops -	Laptops XPS 15(9520, Mid 2022)XPS 17(9720, Mid 2022)Alienware X17(R2, Early 2022)
Desktops Framework Desktop(Early 2025)	Desktops -

Competitors

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