AMD Ryzen AI Max+ 395 vs Intel Core i9-14900HX Full Specs

Summary

16 Cores 32 Threads 3GHz	24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz
TDP 65W	TDP 55W
Bandwidth 256GB/s LPDDR5X	Bandwidth 89.6GB/s DDR5·DDR4
iGPU Radeon 8060S	iGPU UHD 32EU 1650MHz Gen 12
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16
Socket FP11	Socket BGA 1964

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max+ 3952,984

x1.01

Core i9-14900HX2,950

x1

Show Top Score

Core Config

16 Cores 16P -	24 Cores 8P 16E
32 Threads 32P -	32 Threads 16P 16E

Clocks

Base Clock 3GHz	Base Clock 2.2GHz
Boost Clock 5.1GHz	Boost Clock 5.8GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 32KB P -	L1i 32KB P 64KB E
L1d 48KB P -	L1d 48KB P 32KB E
L2 1MB P -	L2 2MB P 16MB E shared
L3 64MB	L3 36MB

Memory

Type LPDDR5X	Type DDR5·DDR4
Max Memory 128GB	Max Memory 192GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 5600MT/s
Bandwidth 256GB/s	Bandwidth 89.6GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s

Power & Thermals

TDP 65W	TDP 55W
cTDP-down 45W	cTDP-down 45W
cTDP-up 120W	cTDP-up -
Peak Power -	Peak Power 157W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Radeon 8060S	iGPU UHD 32EU 1650MHz Gen 12
Shaders 2560	Shaders 256
Boost Clock 2.9GHz	Boost Clock 1.65GHz
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model GNA 3.0
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Raptor Lake
Family Ryzen AI 300	Family Core 14th Gen
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core -	Codename Raptor Lake-HX - Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 8, 2024

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node Intel 7 -
Die Size 141mm²	Die Size 257mm²
Transistor Count 16.6 Billion	Transistor Count 18.5 Billion
Transistor Density 118 MTr/mm²	Transistor Density 72 MTr/mm²

Images

No images available

No images available

Used In

Laptops -	Laptops Blade 18(Early 2024)Alienware m18(R2, Early 2024)Blade 16(Early 2024)
Desktops Framework Desktop(Early 2025)	Desktops -

Competitors

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 385 Show 12 more

IntelCore i9-14900HX vs CPU IntelCore Ultra 9 275HX IntelCore i9-14900HX vs CPU IntelCore Ultra 9 285HX IntelCore i9-14900HX vs CPU IntelCore Ultra 7 265HX Show 12 more