AMD Ryzen AI Max+ 395 vs Intel Mobile Pentium 4 HT 552 Full Specs

Summary

16 Cores 32 Threads 3GHz	1 Cores 2 Threads 3.46GHz
TDP 65W	TDP 88W
Bandwidth 256GB/s LPDDR5X	Bandwidth -
iGPU Radeon 8060S	iGPU -
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 -
Socket FP11	Socket Socket 478

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max+ 3952,984

x22.95

Mobile Pentium 4 HT 552130

x1

Show Top Score

Core Config

16 Cores	1 Cores
32 Threads	2 Threads

Clocks

Base Clock 3GHz	Base Clock 3.46GHz
Boost Clock 5.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 16KB
L1d 48KB	L1d 16KB
L2 1MB	L2 1MB
L3 64MB	L3 -

Memory

Type LPDDR5X	Type -
Max Memory 128GB	Max Memory -
ECC No	ECC -
Channels 4	Channels -
Bus Width 256-bit	Bus Width -
Speed 8000MT/s	Speed -
Bandwidth 256GB/s	Bandwidth -
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator -

Power & Thermals

TDP 65W	TDP 88W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Voltage Range -	Voltage Range -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type FSB
Bus Config 4 lanes	Bus Config 64-bit
Bus Speed 16GT/s	Bus Speed 533MT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 4.3GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

-

iGPU

iGPU Radeon 8060S	iGPU -
Shaders 2560	Shaders -
Boost Clock 2.9GHz	Boost Clock -
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 -

NPU

NPU Model XDNA 2	NPU Model -
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture NetBurst
Family Ryzen AI 300	Family Pentium 4
Branding	Branding
Codename Strix Halo EldoraDie Zen 5P-Core	Codename Prescott - -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 4, 2005

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node 90nm -
Die Size 141mm²	Die Size 112mm²
Transistor Count 16.6 Billion	Transistor Count 125 Million
Transistor Density 118 MTr/mm²	Transistor Density 1 MTr/mm²

Images

No images available

No images available

Used In

Desktops Framework Desktop(Early 2025)

Desktops -

Competitors

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 385 Show 12 more

IntelMobile Pentium 4 HT 552 vs CPU QualcommSnapdragon X2 Elite Extreme (X2E-96-100) IntelMobile Pentium 4 HT 552 vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) IntelMobile Pentium 4 HT 552 vs CPU QualcommSnapdragon X2 Elite (X2E-88-100) Show 4 more