AMD Ryzen AI Max+ PRO 395 vs Intel Core Ultra 9 288V Full Specs
16 Cores 32 Threads 3GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 5.1GHz |
TDP 65W | TDP 30W |
Bandwidth 256GB/s LPDDR5X | Bandwidth 136.5GB/s LPDDR5X |
iGPU | iGPU |
·· 29.7 TFLOPSFP16 | ·· 134.3 TFLOPSFP16 |
Socket | Socket |
Ryzen AI Max+ PRO 395-
Core Ultra 9 288V2,88916 Cores 16P - | 8 Cores 4P 4E |
32 Threads 32P - | 8 Threads 4P 4E |
Base Clock 3GHz | Base Clock 5.1GHz |
Boost Clock 5.1GHz | Boost Clock - |
Overclocking Locked | Overclocking Locked |
L0i - | L0i 64KB |
L0d - | L0d 48KB |
L1i 32KB P - | L1i - 64KB E |
L1d 48KB P - | L1d 192KB P 32KB E |
L2 1MB P - | L2 2.5MB P 4MB E shared |
L3 64MB | L3 12MB |
Type LPDDR5X | Type LPDDR5X |
Max Memory 128GB | Max Memory 32GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 256-bit | Bus Width 128-bit |
Speed 8000MT/s | Speed 8533MT/s |
Bandwidth 256GB/s | Bandwidth 136.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 256GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 136.5GB/s |
TDP 65W | TDP 30W |
cTDP-down 45W | cTDP-down 17W |
cTDP-up 120W | cTDP-up - |
Peak Power - | Peak Power 37W |
Max Operating Temp 100°C Max | Max Operating Temp 100°C Max |
Included Cooler 0 | Included Cooler - |
Bus Type PCIe | Bus Type - |
Bus Config 4 lanes | Bus Config - |
Bus Speed 16GT/s | Bus Speed - |
Bus Bandwidth 8GB/s | Bus Bandwidth - |
PCIe PCIe 4.0 x1631.5GB/sBandwidth | PCIe PCIe 5.0 x415.8GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 2560 | Shaders 1024 |
Boost Clock 2.9GHz | Boost Clock 2.05GHz |
·· 29.7 TFLOPSFP16 | ·· 134.3 TFLOPSFP16 |
NPU Model XDNA 2 | NPU Model AI Boost 4 |
NPU Cores 32 | NPU Cores 6 |
Performance 50 TOPSINT8 | Performance 48 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Strix Halo EldoraDie - Zen 5P-Core - | Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 6, 2025 | Release Date Sep 3, 2024 |
Foundry TSMC | Foundry TSMC |
Other Foundries - - TSMCSoC | Other Foundries IntelFIB TSMCIO - |
Fabrication Node N4X - - N5SoC | Fabrication Node N3B 22nmFIB N6IO - |
Die Size 141mm² - | Die Size 140mm² 46mm²IO |
Transistor Count 16.6 Billion | Transistor Count - |
Transistor Density 118 MTr/mm² | Transistor Density - |
No images available
No images available
Laptops - | Laptops |