AMD Ryzen AI Max PRO 380 vs Intel Xeon E-2176M Full Specs

Summary

6 Cores 12 Threads 3.6GHz	6 Cores 12 Threads 2.7GHz
TDP 65W	TDP 45W
Bandwidth 256GB/s LPDDR5X	Bandwidth 42.7GB/s DDR4·LPDDR3
iGPU Radeon 8040S	iGPU UHD 630 1200MHz
Peak·FP32·FP16 11.47 TFLOPSFP16	Peak·FP32·FP16 460.8 GFLOPSFP16
Socket FP11	Socket BGA 1440

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max PRO 380-

-

Xeon E-2176M1,417

x1

Show Top Score

Core Config

6 Cores	6 Cores
12 Threads	12 Threads

Clocks

Base Clock 3.6GHz	Base Clock 2.7GHz
Boost Clock 4.9GHz	Boost Clock 4.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 48KB	L1d 32KB
L2 1MB	L2 256KB
L3 16MB	L3 12MB

Memory

Type LPDDR5X	Type DDR4·LPDDR3
Max Memory 128GB	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 2666MT/s
Bandwidth 256GB/s	Bandwidth 42.7GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate2666MT/s Calculated Bandwidth 42.7GB/s

Power & Thermals

TDP 65W	TDP 45W
cTDP-down 45W	cTDP-down 35W
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 8GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

iGPU

iGPU Radeon 8040S	iGPU UHD 630 1200MHz
Shaders 1024	Shaders 192
Boost Clock 2.8GHz	Boost Clock 1.2GHz
Peak·FP32·FP16 11.47 TFLOPSFP16	Peak·FP32·FP16 460.8 GFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model -
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Skylake
Family Ryzen AI 300	Family Xeon 1
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core	Codename Coffee Lake-B - Coffee Lake-6CVariant -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Apr 5, 2018

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node 14nm++ -
Die Size 71mm²	Die Size 150mm²
Transistor Count 8.3 Billion	Transistor Count 2.5 Billion
Transistor Density 118 MTr/mm²	Transistor Density 17 MTr/mm²

Images

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