AMD Ryzen AI Max PRO 385 vs Apple M1 Pro (8C14G) Full Specs

Summary

8 Cores 16 Threads 3.6GHz	8 Cores(6P+2E) 8 Threads(6P+2E) 3.23GHz
TDP 65W	TDP 60W
Bandwidth 256GB/s LPDDR5X	Bandwidth 204.8GB/s LPDDR5
iGPU Radeon 8050S	iGPU 14-Core M1 Pro
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 4.64 TFLOPSFP16
Socket FP11	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max PRO 385-

-

M1 Pro (8C14G)2,400

x1

Show Top Score

Core Config

8 Cores 8P -	8 Cores 6P 2E
16 Threads 16P -	8 Threads 6P 2E

Clocks

Base Clock 3.6GHz	Base Clock 3.23GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 24MB P shared 4MB E shared
L3 32MB	L3 -
SLC Cache -	SLC Cache 24MB

Memory

Type LPDDR5X	Type LPDDR5
Max Memory 128GB	Max Memory 32GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 256-bit
Speed 8000MT/s	Speed 6400MT/s
Bandwidth 256GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 65W	TDP 60W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x14 27.6GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU 14-Core M1 Pro
Shaders 2048	Shaders 1792
Boost Clock 2.8GHz	Boost Clock 1.3GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 4.64 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H13 Eos
NPU Cores 32	NPU Cores 16
NPU Clock -	NPU Clock 1.5GHz
Performance 50 TOPSINT8	Performance 11 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 10ARMv8.5-A
Family Ryzen AI 300	Family M Series
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core -	Codename Jade-Chop - M1 ProVariant FirestormP-Core IcestormE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Oct 26, 2021

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node N5 -
Die Size 71mm²	Die Size 253mm²
Transistor Count 8.3 Billion	Transistor Count 33.7 Billion
Transistor Density 118 MTr/mm²	Transistor Density 133 MTr/mm²

Images

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Used In

Laptops -

Laptops MacBook Pro 14(M1 Pro, Late 2021)

Competitors

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