Apple A10 Fusion vs Intel Pentium Gold 6500Y Full Specs

Summary

4 Cores(2P+2E) 4 Threads(2P+2E) 2.34GHz	2 Cores 4 Threads 1.1GHz
TDP 5W	TDP 5W
Bandwidth 25.6GB/s LPDDR4	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU PowerVR GT7600 Plus A10	iGPU UHD 615 23EU 900MHz
Peak·FP32·FP16 774.1 GFLOPSFP16	Peak·FP32·FP16 331.2 GFLOPSFP16
Socket -	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

A10 Fusion874

x1

Pentium Gold 6500Y996

x1.14

Show Top Score

Core Config

4 Cores 2P 2E	2 Cores 2P -
4 Threads 2P 2E	4 Threads 4P -

Clocks

Base Clock 2.34GHz	Base Clock 1.1GHz
Boost Clock -	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 32KB E	L1i 32KB P -
L1d 64KB P 32KB E	L1d 32KB P -
L2 3MB P shared 1MB E shared	L2 256KB P - -
L3 4MB	L3 4MB

Memory

Type LPDDR4	Type LPDDR3·DDR3L
Max Memory 3GB	Max Memory 16GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 3200MT/s	Speed 1866MT/s
Bandwidth 25.6GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W	TDP 5W
cTDP-down -	cTDP-down 4W
cTDP-up -	cTDP-up 7W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU PowerVR GT7600 Plus A10	iGPU UHD 615 23EU 900MHz
Shaders 192	Shaders 184
Boost Clock 1.01GHz	Boost Clock 900MHz
Peak·FP32·FP16 774.1 GFLOPSFP16	Peak·FP32·FP16 331.2 GFLOPSFP16

Controller

Controller Model -	Controller Model 300 Series Y+
Codename -	Codename Amber Lake
PCIe -	PCIe -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 6ARMv8.1-A	Architecture Skylake
Family A Series	Family Pentium
Branding	Branding
Codename Cayman A10Variant HurricaneP-Core ZephyrE-Core	Codename Amber Lake-Y Amber Lake-2CVariant - -
Market Segment Smartphone	Market Segment Laptop
Release Date Sep 16, 2016	Release Date Jan 3, 2021

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 16FFC -	Fabrication Node 14nm++ 22nmPCH
Die Size 125mm² -	Die Size 103mm² 52mm²PCH
Transistor Count 3.3 Billion	Transistor Count 1.8 Billion
Transistor Density 26 MTr/mm²	Transistor Density 17 MTr/mm²

Images

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Used In

Smartphones iPhone 7iPhone 7 Plus	Smartphones -
Tablets iPad 6(A10, Early 2018)iPad 7(A10, Late 2019)	Tablets Surface Go 3(Amber Lake-R, Late 2021)

Competitors

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