Apple A10 Fusion vs Qualcomm Snapdragon 845 Full Specs

Summary

4 Cores(2P+2E) 4 Threads(2P+2E) 2.34GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.8GHz
TDP 5W	TDP 5W
Bandwidth 25.6GB/s LPDDR4	Bandwidth 29.9GB/s LPDDR4X
iGPU PowerVR GT7600 Plus A10	iGPU Adreno 630
Peak·FP32·FP16 774.1 GFLOPSFP16	Peak·FP32·FP16 1.45 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A10 Fusion874

x1.77

Snapdragon 845493

x1

Show Top Score

Core Config

4 Cores 2P 2E	8 Cores 4P 4E
4 Threads 2P 2E	8 Threads 4P 4E

Clocks

Base Clock 2.34GHz	Base Clock 2.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 32KB E	L1i 32KB P 32KB E
L1d 64KB P 32KB E	L1d 32KB P 32KB E
L2 3MB P shared 1MB E shared	L2 256KB P 128KB E - -
L3 4MB	L3 2MB
SLC Cache -	SLC Cache 3MB

Memory

Type LPDDR4	Type LPDDR4X
Max Memory 3GB	Max Memory 16GB
ECC No	ECC No
Channels 1	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 3200MT/s	Speed 3733MT/s
Bandwidth 25.6GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU PowerVR GT7600 Plus A10	iGPU Adreno 630
Shaders 192	Shaders 512
Boost Clock 1.01GHz	Boost Clock 710MHz
Peak·FP32·FP16 774.1 GFLOPSFP16	Peak·FP32·FP16 1.45 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon 685
Performance -	Performance 3 TOPS

Cellular

Modem Model -	Modem Model X20
Peak Down -	Peak Down Up to 1.2Gbps
Peak Up -	Peak Up Up to 150Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 6ARMv8.1-A	Architecture Kryo 385ARMv8.2-A
Family A Series	Family 8 Series
Branding	Branding
Codename Cayman A10Variant HurricaneP-Core ZephyrE-Core	Codename - - Cortex-A75P-Core Cortex-A55E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 16, 2016	Release Date Dec 6, 2017

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node 16FFC	Fabrication Node 10LPP
Die Size 125mm²	Die Size -
Transistor Count 3.3 Billion	Transistor Count -
Transistor Density 26 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Smartphones iPhone 7iPhone 7 Plus	Smartphones Pixel 3Pixel 3 XL
Tablets iPad 6(A10, Early 2018)iPad 7(A10, Late 2019)	Tablets -

Competitors

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QualcommSnapdragon 845 vs CPU QualcommSnapdragon 8 Elite Gen 5 QualcommSnapdragon 845 vs CPU QualcommSnapdragon 8 Elite Galaxy QualcommSnapdragon 845 vs CPU QualcommSnapdragon 8 Elite Show 12 more