CPUs

Apple A13 Bionic vs Samsung Exynos 7872 Full Specs

6 Cores(2P+4E)
6 Threads(2P+4E)
2.67GHz
6 Cores(2P+4E)
6 Threads(2P+4E)
2GHz
TDP
5W
TDP
5W
Bandwidth
34.1GB/s
LPDDR4X
Bandwidth
7.5GB/s
LPDDR3
iGPU
iGPU
··
629.8 GFLOPSFP16
··
57.6 GFLOPSFP16

6 Cores
2P
4E
6 Cores
2P
4E
6 Threads
2P
4E
6 Threads
2P
4E

Base Clock
2.67GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
128KB P
96KB E
L1i
-
L1d
128KB P
48KB E
L1d
-
L2
8MB P shared
4MB E shared
L2
-
-
-
SLC Cache
16MB
SLC Cache
-

Type
LPDDR4X
Type
LPDDR3
Max Memory
4GB
Max Memory
-
ECC
No
ECC
No
Channels
1
Channels
1
Bus Width
64-bit
Bus Width
32-bit
Speed
4266MT/s
Speed
1866MT/s
Bandwidth
34.1GB/s
Bandwidth
7.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
7.5GB/s

TDP
5W
TDP
5W

PCIe
PCIe 3.0 x5
4.9GB/sBandwidth
-

iGPU
iGPU
Shaders
256
Shaders
12
Boost Clock
1.23GHz
Boost Clock
1.2GHz
··
629.8 GFLOPSFP16
··
57.6 GFLOPSFP16

NPU Model
H12 Metis
NPU Model
-
NPU Cores
8
NPU Cores
-
NPU Clock
1.32GHz
NPU Clock
-
Performance
5.5 TOPSFP16
Performance
-

Modem Model
-
Modem Model
Shannon 300/150
Peak Down
-
Peak Down
Up to 300Mbps
Peak Up
-
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
-
Branding
A13  branding
Branding
Exynos 7872  branding
Codename
Cebu
A13Variant
LightningP-Core
ThunderE-Core
Codename
-
-
Cortex-A73P-Core
Cortex-A53E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 20, 2019
Release Date
Jan 1, 2018

Foundry
TSMC
Foundry
-
Fabrication Node
N7P
Fabrication Node
-
Die Size
98mm²
Die Size
-
Transistor Count
8.5 Billion
Transistor Count
-
Transistor Density
86 MTr/mm²
Transistor Density
-

Smartphones
Smartphones
-
Tablets
Tablets
-