Apple A15 Bionic vs Qualcomm Snapdragon 7s Gen 3 Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 3.23GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.5GHz
TDP 5W	TDP -
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 25.6GB/s LPDDR5
iGPU 4-Core A15	iGPU Adreno 810
Peak·FP32·FP16 1.37 TFLOPSFP16	Peak·FP32·FP16 1.07 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A15 Bionic2,383

x2.03

Snapdragon 7s Gen 31,173

x1

Show Top Score

Core Config

6 Cores 2P - 4E	8 Cores 1P 3M 4E
6 Threads 2P - 4E	8 Threads 1P 3M 4E

Clocks

Base Clock 3.23GHz	Base Clock 2.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P - 128KB E	L1i 64KB P 64KB M 32KB E
L1d 128KB P - 64KB E	L1d 64KB P 64KB M 32KB E
L2 12MB P shared 4MB E shared	L2 512KB P 512KB M 128KB E - -
SLC Cache 32MB	SLC Cache 1MB

Memory

Type LPDDR4X	Type LPDDR5
Max Memory 4GB	Max Memory 16GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 32-bit
Speed 4266MT/s	Speed 6400MT/s
Bandwidth 34.1GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 5W

TDP -

Expansion

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

-

iGPU

iGPU 4-Core A15	iGPU Adreno 810
Shaders 512	Shaders 256
Boost Clock 1.34GHz	Boost Clock 1.05GHz
Peak·FP32·FP16 1.37 TFLOPSFP16	Peak·FP32·FP16 1.07 TFLOPSFP16

NPU

NPU Model H14 Bia	NPU Model Hexagon
NPU Cores 16	NPU Cores -
NPU Clock 1.94GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance -

Cellular

Modem Model -	Modem Model X63
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 5.0Gbps
Peak Up -	Peak Up Up to 1.6Gbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 11ARMv8.5-A	Architecture KryoARMv9.2-A
Family A Series	Family 7 Series
Branding	Branding
Codename Ellis A15Variant AvalancheP-Core - BlizzardE-Core	Codename - - Cortex-A720P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 24, 2021	Release Date Aug 1, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5P	Fabrication Node N6
Die Size 108mm²	Die Size -
Transistor Count 15 Billion	Transistor Count -
Transistor Density 139 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Smartphones iPhone SE 3(Gen 3)iPhone 13 miniiPhone 13

Smartphones Nothing Phone 3aNothing Phone 3a Pro

Competitors

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QualcommSnapdragon 7s Gen 3 vs CPU QualcommSnapdragon 7+ Gen 3 QualcommSnapdragon 7s Gen 3 vs CPU QualcommSnapdragon 7 Gen 4 QualcommSnapdragon 7s Gen 3 vs CPU QualcommSnapdragon 7 Gen 3 Show 12 more