CPUs

Apple A16 (iPad) vs MediaTek MT8382 Full Specs

5 Cores(2P+3E)
5 Threads(2P+3E)
3.44GHz
4 Cores
4 Threads
1.3GHz
TDP
5W
TDP
-
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
-
iGPU
iGPU
··
1.37 TFLOPSFP16
··
8 GFLOPSFP32

A16 (iPad)A16 (iPad)2,586
x1
MT8382MT8382-
-

5 Cores
2P
3E
4 Cores
4P
-
5 Threads
2P
3E
4 Threads
4P
-

Base Clock
3.44GHz
Base Clock
1.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
16KB P
-
L1d
128KB P
64KB E
L1d
16KB P
-
L2
16MB P shared
4MB E shared
L2
256KB P
-
-
SLC Cache
24MB
SLC Cache
-

Type
LPDDR5
Type
-
Max Memory
8GB
Max Memory
-
ECC
No
ECC
-
Channels
1
Channels
-
Bus Width
64-bit
Bus Width
-
Speed
6400MT/s
Speed
-
Bandwidth
51.2GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
-

TDP
5W
TDP
-

PCIe
PCIe 4.0 x4
7.9GB/sBandwidth
-

iGPU
iGPU
Shaders
512
Shaders
8
Boost Clock
1.34GHz
Boost Clock
500MHz
··
1.37 TFLOPSFP16
··
8 GFLOPSFP32

NPU Model
H15 Themis
NPU Model
-
NPU Cores
16
NPU Cores
-
NPU Clock
2.06GHz
NPU Clock
-
Performance
17 TOPSFP16
Performance
-

Modem Model
-
Modem Model
MT HSPA+
Peak Down
-
Peak Down
Up to 42.2Mbps
Peak Up
-
Peak Up
Up to 5.8Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch32
Architecture
Architecture
Family
Family
-
Branding
A16  branding
Branding
MT8382 branding
Codename
Crete
A16Variant
EverestP-Core
Sawtooth E-Core
Codename
-
-
Cortex-A7P-Core
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Mar 4, 2025
Release Date
Mar 1, 2014

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N4P
Fabrication Node
45nm
Die Size
115mm²
Die Size
-
Transistor Count
16 Billion
Transistor Count
-
Transistor Density
139 MTr/mm²
Transistor Density
-

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