Apple A16 (iPad) vs Qualcomm Snapdragon 200 (MSM8212) Full Specs

Summary

5 Cores(2P+3E) 5 Threads(2P+3E) 3.44GHz	4 Cores 4 Threads 1.2GHz
TDP 5W	TDP 5W
Bandwidth 51.2GB/s LPDDR5	Bandwidth 2.7GB/s LPDDR2
iGPU 4-Core A16	iGPU Adreno 302
Peak·FP32·FP16 1.37 TFLOPSFP16	Peak·FP32·FP16 25.6 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A16 (iPad)2,586

x1

Snapdragon 200 (MSM8212)-

-

Show Top Score

Core Config

5 Cores 2P 3E	4 Cores 4P -
5 Threads 2P 3E	4 Threads 4P -

Clocks

Base Clock 3.44GHz	Base Clock 1.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 16KB P -
L1d 128KB P 64KB E	L1d 16KB P -
L2 16MB P shared 4MB E shared	L2 512KB P shared -
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR2
Max Memory 8GB	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 6400MT/s	Speed 666MT/s
Bandwidth 51.2GB/s	Bandwidth 2.7GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate666MT/s Calculated Bandwidth 2.7GB/s

Power & Thermals

TDP 5W

TDP 5W

Expansion

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

-

iGPU

iGPU 4-Core A16	iGPU Adreno 302
Shaders 512	Shaders 16
Boost Clock 1.34GHz	Boost Clock 400MHz
Peak·FP32·FP16 1.37 TFLOPSFP16	Peak·FP32·FP16 25.6 GFLOPSFP16

NPU

NPU Model H15 Themis	NPU Model Hexagon QDSP6
NPU Cores 16	NPU Cores -
NPU Clock 2.06GHz	NPU Clock -
Performance 17 TOPSFP16	Performance -

Cellular

Modem Model -	Modem Model Gobi 2000
Peak Down -	Peak Down Up to 7.2Mbps
Peak Up -	Peak Up Up to 5.8Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture Apple Silicon 12ARMv8.6-A	Architecture ARMv7-A
Family A Series	Family 2 Series
Branding	Branding
Codename Crete A16Variant EverestP-Core Sawtooth E-Core	Codename - - Cortex-A7P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 4, 2025	Release Date Jul 1, 2013

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N4P	Fabrication Node 45nm
Die Size 115mm²	Die Size -
Transistor Count 16 Billion	Transistor Count -
Transistor Density 139 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Tablets iPad 11(A16, Early 2025)

Tablets -

Competitors

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