CPUs

Apple A17 Pro vs Apple A4 Full Specs

6 Cores(2P+4E)
6 Threads(2P+4E)
3.77GHz
1 Cores
1 Threads
800MHz
TDP
5W
TDP
5W
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
3.2GB/s
LPDDR
iGPU
iGPU
··
2.06 TFLOPSFP16
··
2.13 GFLOPSFP32

A17 ProA17 Pro2,941
x1
A4A4-
-

6 Cores
2P
4E
1 Cores
1P
-
6 Threads
2P
4E
1 Threads
1P
-

Base Clock
3.77GHz
Base Clock
800MHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
32KB P
-
L1d
128KB P
64KB E
L1d
32KB P
-
L2
16MB P shared
4MB E shared
L2
512KB P
-
-
SLC Cache
24MB
SLC Cache
-

Type
LPDDR5
Type
LPDDR
Max Memory
8GB
Max Memory
512MB
ECC
No
ECC
No
Channels
1
Channels
2
Bus Width
64-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
400MT/s
Bandwidth
51.2GB/s
Bandwidth
3.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
3.2GB/s

TDP
5W
TDP
5W
Peak Power
14W
Peak Power
-

PCIe
PCIe 4.0 x6
11.8GB/sBandwidth
-

iGPU
iGPU
Shaders
768
Shaders
4
Boost Clock
1.34GHz
Boost Clock
266MHz
··
2.06 TFLOPSFP16
··
2.13 GFLOPSFP32

NPU Model
H16x Laso
NPU Model
-
NPU Cores
16
NPU Cores
-
NPU Clock
2.16GHz
NPU Clock
-
Performance
35 TOPSINT8
Performance
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch32
Architecture
Architecture
Family
Family
Branding
A17 Pro  branding
Branding
A4  branding
Codename
Coll
A17 ProVariant
AS13PP-Core
AS13EE-Core
Codename
A4
-
Cortex-A8P-Core
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 12, 2023
Release Date
Sep 10, 2010

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N3B
Fabrication Node
45nm
Die Size
104mm²
Die Size
53mm²
Transistor Count
19 Billion
Transistor Count
-
Transistor Density
183 MTr/mm²
Transistor Density
-

No images available
No images available