Apple A18 Pro (Neo) vs Qualcomm Snapdragon 400 (MSM8930AB) Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.04GHz	2 Cores 2 Threads 1.7GHz
TDP 5W	TDP 5W
Bandwidth 60GB/s LPDDR5X	Bandwidth 4.3GB/s LPDDR2
iGPU 5-Core A18 Pro	iGPU Adreno 305+
Peak·FP32·FP16 1.88 TFLOPSFP16	Peak·FP32·FP16 38.4 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A18 Pro (Neo)3,409

x1

Snapdragon 400 (MSM8930AB)-

-

Show Top Score

Core Config

6 Cores 2P 4E	2 Cores 2P -
6 Threads 2P 4E	2 Threads 2P -

Clocks

Base Clock 4.04GHz	Base Clock 1.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 16KB P -
L1d 128KB P 64KB E	L1d 16KB P -
L2 16MB P shared 4MB E shared	L2 1MB P shared -
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR2
Max Memory 8GB	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 7500MT/s	Speed 1066MT/s
Bandwidth 60GB/s	Bandwidth 4.3GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 60GB/s	Bandwidth Calculator Channels Transfer Rate1066MT/s Calculated Bandwidth 4.3GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 12W	Peak Power -

Expansion

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

-

iGPU

iGPU 5-Core A18 Pro	iGPU Adreno 305+
Shaders 640	Shaders 24
Boost Clock 1.47GHz	Boost Clock 400MHz
Peak·FP32·FP16 1.88 TFLOPSFP16	Peak·FP32·FP16 38.4 GFLOPSFP16

NPU

NPU Model H17 Theia	NPU Model Hexagon QDSP6
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock -
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model Gobi 4000
Peak Down -	Peak Down Up to 100Mbps
Peak Up -	Peak Up Up to 50Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture Apple Silicon 14ARMv9.2-A	Architecture Krait 300ARMv7-A
Family A Series	Family 4 Series
Branding	Branding
Codename Tahiti A18 ProVariant AS14PP-Core AS14EE-Core	Codename - - Cortex-A15P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 4, 2026	Release Date Dec 5, 2013

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3E	Fabrication Node 28nm LP
Die Size 110mm²	Die Size -
Transistor Count 18.4 Billion	Transistor Count -
Transistor Density 168 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Laptops MacBook Neo(Early 2026)

Laptops -

Competitors

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QualcommSnapdragon 400 (MSM8930AB) vs CPU QualcommSnapdragon 4s Gen 2 QualcommSnapdragon 400 (MSM8930AB) vs CPU QualcommSnapdragon 4 Gen 2 QualcommSnapdragon 400 (MSM8930AB) vs CPU AppleA19 (17e) Show 12 more