Apple A18 Pro (Neo) vs UNISOC W517 Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.04GHz	4 Cores(1P+3E) 4 Threads(1P+3E) 2GHz
TDP 5W	TDP 3W
Bandwidth 60GB/s LPDDR5X	Bandwidth 9.6GB/s LPDDR4X·LPDDR3
iGPU 5-Core A18 Pro	iGPU PowerVR GE8300 800MHz
Peak·FP32·FP16 1.88 TFLOPSFP16	Peak·FP32·FP16 51.2 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A18 Pro (Neo)3,409

x1

W517-

-

Show Top Score

Core Config

6 Cores 2P 4E	4 Cores 1P 3E
6 Threads 2P 4E	4 Threads 1P 3E

Clocks

Base Clock 4.04GHz	Base Clock 2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P 32KB E
L1d 128KB P 64KB E	L1d 32KB P 32KB E
L2 16MB P shared 4MB E shared	L2 512KB P 128KB E - -
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR4X·LPDDR3
Max Memory 8GB	Max Memory -
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 32-bit
Speed 7500MT/s	Speed 2400MT/s
Bandwidth 60GB/s	Bandwidth 9.6GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 60GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 9.6GB/s

Power & Thermals

TDP 5W	TDP 3W
Peak Power 12W	Peak Power -

Expansion

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

-

iGPU

iGPU 5-Core A18 Pro	iGPU PowerVR GE8300 800MHz
Shaders 640	Shaders 16
Boost Clock 1.47GHz	Boost Clock 800MHz
Peak·FP32·FP16 1.88 TFLOPSFP16	Peak·FP32·FP16 51.2 GFLOPSFP16

NPU

NPU Model H17 Theia	NPU Model -
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock -
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model UNISOC LTE 4
Peak Down -	Peak Down Up to 150Mbps
Peak Up -	Peak Up Up to 50Mbps

Chip

Manufacturer Apple	Manufacturer UNISOC
ISA AArch64	ISA AArch64
Architecture Apple Silicon 14ARMv9.2-A	Architecture ARMv8.2-A
Family A Series	Family -
Branding	Branding
Codename Tahiti A18 ProVariant AS14PP-Core AS14EE-Core	Codename - - Cortex-A75P-Core Cortex-A55E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 4, 2026	Release Date Sep 6, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N7
Die Size 110mm²	Die Size -
Transistor Count 18.4 Billion	Transistor Count -
Transistor Density 168 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Laptops MacBook Neo(Early 2026)

Laptops -

Competitors

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UNISOCW517 vs CPU AppleA16 (iPad) UNISOCW517 vs CPU AppleA17 Pro UNISOCW517 vs CPU AppleA19 (17e) Show 12 more