Apple A18 Pro vs Qualcomm Snapdragon 8 Gen 3 Galaxy Full Specs
6 Cores(2P+4E) 6 Threads(2P+4E) 4.04GHz | 8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.39GHz |
TDP 5W | TDP 5W |
Bandwidth 60GB/s LPDDR5X | Bandwidth 76.8GB/s LPDDR5X |
iGPU | iGPU |
·· 2.26 TFLOPSFP16 | ·· 5.53 TFLOPSFP16 |
A18 Pro3,409
Snapdragon 8 Gen 3 Galaxy2,2716 Cores 2P - 4E | 8 Cores 1P 5M 2E |
6 Threads 2P - 4E | 8 Threads 1P 5M 2E |
Base Clock 4.04GHz | Base Clock 3.39GHz |
Overclocking Locked | Overclocking Locked |
L1i 192KB P - 128KB E | L1i 64KB P 64KB M 32KB E |
L1d 128KB P - 64KB E | L1d 64KB P 64KB M 32KB E |
L2 16MB P shared 4MB E shared | L2 1MB P 512KB M 128KB E - - |
L3 - | L3 12MB |
SLC Cache 24MB | SLC Cache 4MB |
Type LPDDR5X | Type LPDDR5X |
Max Memory 8GB | Max Memory 24GB |
ECC No | ECC No |
Channels 1 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 7500MT/s | Speed 9600MT/s |
Bandwidth 60GB/s | Bandwidth 76.8GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 60GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 76.8GB/s |
TDP 5W | TDP 5W |
Peak Power 12W | Peak Power - |
PCIe PCIe 4.0 x611.8GB/sBandwidth | - |
iGPU | iGPU |
Shaders 768 | Shaders 1536 |
Boost Clock 1.47GHz | Boost Clock 900MHz |
·· 2.26 TFLOPSFP16 | ·· 5.53 TFLOPSFP16 |
NPU Model H17 Theia | NPU Model Hexagon |
NPU Cores 16 | NPU Cores - |
NPU Clock 2.17GHz | NPU Clock - |
Performance 35 TOPSINT8 | Performance 45 TOPSINT8 |
Modem Model - | Modem Model X75 |
Cellular - | Cellular 5G mmWave |
Peak Down - | Peak Down Up to 10.0Gbps |
Peak Up - | Peak Up Up to 3.5Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture Apple Silicon 14ARMv9.2-A | Architecture KryoARMv9.0-A |
Family | Family |
Branding  | Branding  |
Codename Tahiti A18 ProVariant AS14PP-Core - AS14EE-Core | Codename - Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Sep 9, 2024 | Release Date Oct 24, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N3E | Fabrication Node N4P |
Die Size 110mm² | Die Size 137mm² |
Transistor Count 18.4 Billion | Transistor Count - |
Transistor Density 168 MTr/mm² | Transistor Density - |
No images available
No images available
Smartphones | Smartphones |