CPUs

Apple A18 vs Apple A9 (Samsung) Full Specs

6 Cores(2P+4E)
6 Threads(2P+4E)
4.04GHz
2 Cores
2 Threads
1.85GHz
TDP
5W
TDP
5W
Bandwidth
60GB/s
LPDDR5X
Bandwidth
25.6GB/s
LPDDR4
iGPU
iGPU
··
1.71 TFLOPSFP16
··
499.2 GFLOPSFP16

6 Cores
2P
4E
2 Cores
2P
-
6 Threads
2P
4E
2 Threads
2P
-

Base Clock
4.04GHz
Base Clock
1.85GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
64KB P
-
L1d
128KB P
64KB E
L1d
64KB P
-
L2
8MB P shared
4MB E shared
L2
3MB P shared
-
L3
-
L3
4MB
SLC Cache
12MB
SLC Cache
-

Type
LPDDR5X
Type
LPDDR4
Max Memory
8GB
Max Memory
2GB
ECC
No
ECC
No
Channels
1
Channels
1
Bus Width
64-bit
Bus Width
64-bit
Speed
7500MT/s
Speed
3200MT/s
Bandwidth
60GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
60GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
25.6GB/s

TDP
5W
TDP
5W
Peak Power
12W
Peak Power
-

PCIe
PCIe 4.0 x3
5.9GB/sBandwidth
-

iGPU
iGPU
Shaders
640
Shaders
192
Boost Clock
1.34GHz
Boost Clock
650MHz
··
1.71 TFLOPSFP16
··
499.2 GFLOPSFP16

NPU Model
H17 Theia
NPU Model
-
NPU Cores
16
NPU Cores
-
NPU Clock
2.17GHz
NPU Clock
-
Performance
35 TOPSINT8
Performance
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
A18  branding
Branding
A9  branding
Codename
Tupai
A18Variant
AS14PP-Core
AS14EE-Core
Codename
Maui
A9 SamsungVariant
TwisterP-Core
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 9, 2024
Release Date
Sep 25, 2015

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N3E
Fabrication Node
14LPP
Die Size
90mm²
Die Size
96mm²
Transistor Count
15.5 Billion
Transistor Count
2.5 Billion
Transistor Density
172 MTr/mm²
Transistor Density
26 MTr/mm²