Apple A19 (17e) vs Qualcomm Snapdragon S3 (MSM8660) Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz	2 Cores 2 Threads 1.7GHz
TDP 5W	TDP 5W
Bandwidth 68.3GB/s LPDDR5X	Bandwidth 2.7GB/s LPDDR2
iGPU 4-Core A19	iGPU Adreno 220
Peak·FP32·FP16 3.01 TFLOPSFP16	Peak·FP32·FP16 34.05 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A19 (17e)3,608

x1

Snapdragon S3 (MSM8660)-

-

Show Top Score

Core Config

6 Cores 2P 4E	2 Cores 2P -
6 Threads 2P 4E	2 Threads 2P -

Clocks

Base Clock 4.26GHz	Base Clock 1.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 128KB P 64KB E	L1d 32KB P -
L2 8MB P shared 4MB E shared	L2 512KB P shared -
SLC Cache 12MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR2
Max Memory 8GB	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 8533MT/s	Speed 666MT/s
Bandwidth 68.3GB/s	Bandwidth 2.7GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 68.3GB/s	Bandwidth Calculator Channels Transfer Rate666MT/s Calculated Bandwidth 2.7GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 11W	Peak Power -

Expansion

PCIe PCIe 4.0 x3 5.9GB/sBandwidth

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iGPU

iGPU 4-Core A19	iGPU Adreno 220
Shaders 512	Shaders 32
Boost Clock 1.47GHz	Boost Clock 266MHz
Peak·FP32·FP16 3.01 TFLOPSFP16	Peak·FP32·FP16 34.05 GFLOPSFP16

NPU

NPU Model H18 Apollo	NPU Model Hexagon QDSP6
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock 400MHz
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model Gobi 3000
Peak Down -	Peak Down Up to 14.4Mbps
Peak Up -	Peak Up Up to 5.8Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture Apple Silicon 15ARMv9.2-A	Architecture ScorpionARMv7-A
Family A Series	Family S3 Series
Branding	Branding
Codename Tilos A19Variant AS15PP-Core AS15EE-Core	Codename - - Cortex-A9P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 2, 2026	Release Date Sep 9, 2010

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3P	Fabrication Node 45nm
Die Size 83mm²	Die Size -
Transistor Count 14.3 Billion	Transistor Count -
Transistor Density 172 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Smartphones iPhone 17e

Smartphones -

Competitors

AppleA19 (17e) vs CPU AppleA18 Pro (Neo) AppleA19 (17e) vs CPU AppleA18 (16e) AppleA19 (17e) vs CPU AppleA18 Show 12 more

QualcommSnapdragon S3 (MSM8660) vs CPU AppleA18 Pro (Neo) QualcommSnapdragon S3 (MSM8660) vs CPU AppleA19 Pro QualcommSnapdragon S3 (MSM8660) vs CPU AppleA19 Show 12 more