Apple A19 vs Qualcomm Snapdragon 821 Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz	4 Cores(2P+2E) 4 Threads(2P+2E) 2.15GHz
TDP 5W	TDP 5W
Bandwidth 68.3GB/s LPDDR5X	Bandwidth 29.9GB/s LPDDR4
iGPU 5-Core A19	iGPU Adreno 530+
Peak·FP32·FP16 15.05 TOPSINT8 Tensor	Peak·FP32·FP16 639 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A193,615

x10.30

Snapdragon 821351

x1

Show Top Score

Core Config

6 Cores 2P 4E	4 Cores 2P 2E
6 Threads 2P 4E	4 Threads 2P 2E

Clocks

Base Clock 4.26GHz	Base Clock 2.15GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P 32KB E
L1d 128KB P 64KB E	L1d 32KB P 32KB E
L2 8MB P shared 4MB E shared	L2 1MB P shared 512KB E shared
SLC Cache 12MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR4
Max Memory 8GB	Max Memory 8GB
ECC No	ECC No
Channels 1	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 8533MT/s	Speed 3733MT/s
Bandwidth 68.3GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 68.3GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s UC·Spec·OC 29.9GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 11W	Peak Power -

Expansion

PCIe PCIe 4.0 x3 5.9GB/sBandwidth

-

iGPU

iGPU 5-Core A19	iGPU Adreno 530+
Shaders 640	Shaders 256
Boost Clock 1.47GHz	Boost Clock 624MHz
Peak·FP32·FP16 15.05 TOPSINT8 Tensor	Peak·FP32·FP16 639 GFLOPSFP16

NPU

NPU Model H18 Apollo	NPU Model Hexagon 680
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock 1GHz
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model X12
Peak Down -	Peak Down Up to 600Mbps
Peak Up -	Peak Up Up to 150Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 15ARMv9.2-A	Architecture KryoARMv8.0-A
Family A Series	Family 8 Series
Branding	Branding
Codename Tilos A19Variant AS15PP-Core AS15EE-Core	Codename - Snapdragon 821Variant - -
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 9, 2025	Release Date Sep 9, 2016
Part Number -	Part Number MSM8996 Pro-AB

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3P	Fabrication Node 14LPP
Die Size 83mm²	Die Size -
Transistor Count 14.3B	Transistor Count -
Transistor Density 172 MTr/mm²	Transistor Density -

Images