Apple A19 vs Qualcomm Snapdragon S4 (Plus MSM8230) Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz	2 Cores 2 Threads 1.2GHz
TDP 5W	TDP 5W
Bandwidth 68.3GB/s LPDDR5X	Bandwidth 4.3GB/s LPDDR2
iGPU 5-Core A19	iGPU Adreno 305+
Peak·FP32·FP16 3.76 TFLOPSFP16	Peak·FP32·FP16 38.4 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A193,608

x1

Snapdragon S4 (Plus MSM8230)-

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Show Top Score

Core Config

6 Cores 2P 4E	2 Cores 2P -
6 Threads 2P 4E	2 Threads 2P -

Clocks

Base Clock 4.26GHz	Base Clock 1.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 16KB P -
L1d 128KB P 64KB E	L1d 16KB P -
L2 8MB P shared 4MB E shared	L2 1MB P shared -
SLC Cache 12MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR2
Max Memory 8GB	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 8533MT/s	Speed 1066MT/s
Bandwidth 68.3GB/s	Bandwidth 4.3GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 68.3GB/s	Bandwidth Calculator Channels Transfer Rate1066MT/s Calculated Bandwidth 4.3GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 11W	Peak Power -

Expansion

PCIe PCIe 4.0 x3 5.9GB/sBandwidth

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iGPU

iGPU 5-Core A19	iGPU Adreno 305+
Shaders 640	Shaders 24
Boost Clock 1.47GHz	Boost Clock 400MHz
Peak·FP32·FP16 3.76 TFLOPSFP16	Peak·FP32·FP16 38.4 GFLOPSFP16

NPU

NPU Model H18 Apollo	NPU Model Hexagon QDSP6
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock -
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model Gobi 2000
Peak Down -	Peak Down Up to 7.2Mbps
Peak Up -	Peak Up Up to 5.8Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture Apple Silicon 15ARMv9.2-A	Architecture KraitARMv7-A
Family A Series	Family S4 Series
Branding	Branding
Codename Tilos A19Variant AS15PP-Core AS15EE-Core	Codename - - Cortex-A15P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 9, 2025	Release Date Jul 1, 2012

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3P	Fabrication Node 28nm
Die Size 83mm²	Die Size -
Transistor Count 14.3 Billion	Transistor Count -
Transistor Density 172 MTr/mm²	Transistor Density -

Images

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Used In

Smartphones iPhone 17

Smartphones -

Competitors

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QualcommSnapdragon S4 (Plus MSM8230) vs CPU AppleA18 Pro (Neo) QualcommSnapdragon S4 (Plus MSM8230) vs CPU AppleA19 (17e) QualcommSnapdragon S4 (Plus MSM8230) vs CPU AppleA19 Pro Show 12 more