CPUs

Apple A6 vs Qualcomm Snapdragon 821 Full Specs

2 Cores
2 Threads
1.3GHz
4 Cores(2P+2E)
4 Threads(2P+2E)
2.15GHz
TDP
5W
TDP
5W
Bandwidth
8.5GB/s
LPDDR2
Bandwidth
29.9GB/s
LPDDR4
iGPU
iGPU
··
41.28 GFLOPSFP32
··
639 GFLOPSFP16

A6A6-
-
Snapdragon 821Snapdragon 821302
x1

2 Cores
2P
-
4 Cores
2P
2E
2 Threads
2P
-
4 Threads
2P
2E

Base Clock
1.3GHz
Base Clock
2.15GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
L1i
32KB P
32KB E
L1d
32KB P
-
L1d
32KB P
32KB E
L2
1MB P shared
-
L2
1MB P shared
512KB E shared

Type
LPDDR2
Type
LPDDR4
Max Memory
1GB
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
1066MT/s
Speed
3733MT/s
Bandwidth
8.5GB/s
Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
8.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
29.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
48
Shaders
256
Boost Clock
430MHz
Boost Clock
624MHz
··
41.28 GFLOPSFP32
··
639 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon 680
NPU Clock
-
NPU Clock
1GHz

Modem Model
-
Modem Model
X12
Peak Down
-
Peak Down
Up to 600Mbps
Peak Up
-
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch32
ISA
AArch64
Architecture
Architecture
KryoARMv8.0-A
Family
Family
Branding
A6  branding
Branding
Snapdragon 8 Series  branding
Codename
Bali
A6Variant
SwiftP-Core
Codename
-
Snapdragon 821Variant
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 21, 2012
Release Date
Sep 9, 2016

Foundry
Samsung
Foundry
Samsung
Fabrication Node
32nm
Fabrication Node
14LPP
Die Size
97mm²
Die Size
-

No images available
No images available

Smartphones
Smartphones